Latest news with #ASIL
Yahoo
08-05-2025
- Automotive
- Yahoo
NXP Unveils Next-Gen Radar Chip To Boost Autonomous Driving Systems
NXP Semiconductors NV (NASDAQ:NXPI) showcased its new S32R47 imaging radar processors in 16 nm FinFET technology on Thursday. The third generation of imaging radar processors delivers up to twice the processing power of the previous generation. With NXP's mmWave radar transceivers, power management, and in-vehicle networking solutions, the S32R47 family meets functional safety ASIL ISO 26262 ASIL B(D) requirements. Also Read: According to Yole Intelligence's Status of the Radar Industry 2024 report, by 2029, approximately 40% of vehicles entering the road will be passenger cars with driving automation Level 2+(L2+)/ Level 3 (L3), with an increasing number of vehicles with Level 4 (L4). Imaging radar leverages richer point cloud data for more detailed modeling of the environment. This is a key enabler for AI-based perception systems, which allow for assisted and autonomous driving in the most challenging environmental conditions, such as complex urban scenarios. The S32R47 integrates a high-performance multi-core radar processing system, allowing denser point cloud output and enhanced algorithms that enable next-generation ADAS systems. This results in better separability of objects, improved detection reliability, and more accurate classification of objects such as vulnerable road users or lost cargo. In April, NXP reported first-quarter results. The company reported first-quarter revenue of $2.84 billion, down 9%, in line with analyst estimates. The company reported first-quarter adjusted earnings of $2.64 per share, beating analyst estimates of $2.58. NXP expects second-quarter revenue of $2.8 billion to $3 billion versus estimates of $2.87 billion. The company sees second-quarter adjusted earnings of $2.46 to $2.86 per share versus estimates of $2.65. "NXP's first-quarter results and guidance for the second quarter underpin a cautious optimism that NXP continues to effectively navigate through a challenging set of market conditions. We are operating in a very uncertain environment influenced by tariffs with volatile direct and indirect effects," said Kurt Sievers, president and CEO of NXP. "Considering these external factors, we are redoubling our efforts to manage what is in our direct control, enabling NXP to drive solid profitability and earnings," Sievers added. Price Action: NXPI stock is trading up 0.97% to $188.69 at the last check on Thursday. Image via Shutterstock Up Next: Transform your trading with Benzinga Edge's one-of-a-kind market trade ideas and tools. Click now to access unique insights that can set you ahead in today's competitive market. Get the latest stock analysis from Benzinga? This article NXP Unveils Next-Gen Radar Chip To Boost Autonomous Driving Systems originally appeared on © 2025 Benzinga does not provide investment advice. All rights reserved. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
National Post
29-04-2025
- Automotive
- National Post
VeriSilicon Launches the Industry-Leading Automotive-Grade Intelligent Driving SoC Design Platform
Article content SHANGHAI — VeriSilicon ( recently announced that its automotive-grade high-performance intelligent driving system-on-chip (SoC) design platform has been verified and successfully implemented in customer projects. Leveraging VeriSilicon's Silicon Platform as a Service (SiPaaS) business model, this platform provides robust technical support for high-performance computing applications such as autonomous driving and advanced driver assistance systems (ADAS). Article content VeriSilicon's chip design process has obtained ISO 26262 automotive functional safety management system certification, enabling the company to provide global customers with one-stop custom service for their automotive chips that meet functional safety requirements. Combined with its extensive portfolio of automotive-grade IPs and complete intelligent driving software platform, VeriSilicon offers end-to-end support from chip design and verification to automotive certification, including safety requirement analysis, architecture design, and certification assistance. Article content The newly launched automotive-grade high-performance intelligent driving SoC design platform adopts a flexible, configurable architecture, supporting efficient collaboration among multiple co-processors, including high-performance multi-core Central Processing Units (CPUs), image signal processors, video codecs, and neural network processors. The platform can be optionally equipped with a built-in ASIL D-level functional safety island developed by VeriSilicon. It also supports a high-speed, high-bandwidth memory subsystem that features excellent data throughput and real-time processing capabilities. Optimized for advanced automotive-grade process nodes, including 5nm and 7nm, this platform delivers outstanding power, performance, and area (PPA) characteristics. Article content 'The intelligent vehicles industry is advancing rapidly, and VeriSilicon's automotive-grade SoC design platform balances performance, safety, and design flexibility, empowering automakers to swiftly address market demands,' said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. 'With over a decade of expertise in the automotive industry, VeriSilicon has built a strong presence in Microcontroller Units (MCUs), in-cabin systems, and intelligent driving technologies. Leveraging our ISO 26262 compliant design processes, IPs, and comprehensive software services, we have successfully delivered custom intelligent driving chips based on advanced automotive-grade process technology to our customers. We are also progressing with the development of Chiplet solutions for intelligent driving. Moving forward, VeriSilicon will continue driving innovation in the automotive sector, contributing to greater safety and intelligence to the industry.' Article content Article content Article content Article content Article content
Yahoo
28-03-2025
- Automotive
- Yahoo
SEALSQ and IC'ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
Geneva, Switzerland, March 28, 2025 (GLOBE NEWSWIRE) -- SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announces a strategic collaboration with IC'ALPS, a premier ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels. Of note, as announced in February 2025, SEALSQ has entered into exclusive negotiations to acquire 100% of the share capital and voting rights of IC'ALPS. As disclosed, the acquisition is subject to, amongst other items, the completion of the appropriate due diligence, execution of definitive agreements, and authorization by French regulatory authorities. With proven track records in automotive applications, IC'ALPS brings expertise in power management ICs, quality design, test-fault coverage and FMEDA (Failure Modes, Effects and Diagnostic Analysis) — positioning this partnership to redefine automotive safety and security by introducing a new class of Application-Specific Integrated Circuits (ASICs) tailored for Functional Safety in the age of post-quantum computing. In an era where modern vehicles can contain more than 1,400 semiconductor components, the role of Functional Safety has become mission critical. Electronics now account for over 40% of a vehicle's cost-doubling from just 18% in the early 2000s. As vehicles become more autonomous, connected, and software-defined, ASICs must deliver more than just performance—they must guarantee safety, reliability, and compliance with the most rigorous standards. Enabling Functional Safety with ASICs Designed for ISO 26262 Through this partnership, SEALSQ's post-quantum secure technology will be integrated into IC'ALPS' automotive ASIC designs, providing robust cryptographic resistance against quantum-era threats. IC'ALPS brings extensive experience in designing chips for systems requiring high Automotive Safety Integrity Levels (ASILs), including analog (LED drivers, PMICs, DCDC converters, high-precision current sensors among others), and digital (embedded microcontroller, hardware accelerators for data signal processing) functions ensuring resilience against both systematic and random hardware failures. ASICs allow system integrators to consolidate multiple functions into a single chip, reducing component count, improving reliability, and enhancing system efficiency. With IC'ALPS' IATF16949-ready design methodology and rigorous test fault coverage for quality assurance, combined with SEALSQ's cryptographic IP, automotive OEMs and Tier 1 suppliers will benefit from ultra-secure, deterministic, and highly customized semiconductor solutions. Benefits of Post-Quantum ASICs in Automotive Applications Functional Safety Compliance: Designed with technical safety requirements (TSRs) mapped from high-level safety goals to ensure ISO 26262 certification. Integrated Security: Native post-quantum cryptography with embedded secure elements and fail-safe mechanisms. Miniaturization & Performance: Reduced system complexity through the integration of digital, analog, RF, and power management functions. Electromagnetic Immunity: Enhanced EMI resistance and EMC validation to ensure robust operation within complex automotive environments. Real-time Responsiveness: Deterministic behavior and low-latency performance essential for safety-critical decisions in autonomous driving systems. Comprehensive Support: Backed by IC'ALPS' customer support, including product training, layout guidelines, and system-level simulation models. Addressing the Challenges of Functional Safety Design ASIC development in automotive contexts requires close collaboration between IC designers and system architects to accurately translate ASIL requirements into chip-level safety mechanisms. IC'ALPS and SEALSQ are co-developing methodologies to ensure safety goals are traceable and measurable—from FMEDA analyses to integrated diagnostics and self-monitoring circuits, supported by IC'ALPS' expertise in application-level validation, debug with design teams, and mature knowledge of functional safety ASIC design methodology. Beyond compliance, the collaboration prioritizes optimization—ensuring that safety features do not unnecessarily inflate development cycles or costs, while leveraging IC'ALPS' project support to streamline integration for OEMs, preserving the competitive edge for automotive clients. A Vision for Secure and Safe Mobility This partnership marks a decisive step forward in shaping the future of automotive security. By embedding post-quantum cryptography and functional safety mechanisms directly into automotive ASICs, SEALSQ and IC'ALPS are empowering the next generation of electric, connected, and autonomous vehicles to be not only smarter—but safer and future-proof with best-in-class expertise driving innovation. About IC'ALPS:IC'ALPS is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the qualification, and the management of the entire production supply chain. Its 100+ engineers' areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 1.8 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, AI, mil-aero and digital identity & security sectors. IC'ALPS is ISO 9001:2015, ISO 13485:2016, EN 9100:2018, Common Criteria certified, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ams Osram Preferred Partner, X-FAB's partner network and Intel Foundry Accelerator Design Service Alliance (DSA).More information on and follow us on About SEALSQ:SEALSQ focuses on selling integrated solutions based on Semiconductors, PKI and Provisioning services, while developing Post-Quantum technology hardware and software products. Our solutions can be used in a variety of applications, from Multi-Factor Authentication tokens, Smart Energy, Smart Home Appliances, Medical and Healthcare and IT Network Infrastructure, to Automotive, Industrial Automation and Control Systems. Post-Quantum Cryptography (PQC) refers to cryptographic methods that are secure against an attack by a quantum computer. As quantum computers become more powerful, they may be able to break many of the cryptographic methods that are currently used to protect sensitive information, such as RSA and Elliptic Curve Cryptography (ECC). PQC aims to develop new cryptographic methods that are secure against quantum attacks. For more information, please visit Forward-Looking StatementsThis communication expressly or implicitly contains certain forward-looking statements concerning SEALSQ Corp and its businesses. Forward-looking statements include statements regarding our business strategy, financial performance, results of operations, market data, events or developments that we expect or anticipates will occur in the future, as well as any other statements which are not historical facts. Although we believe that the expectations reflected in such forward-looking statements are reasonable, no assurance can be given that such expectations will prove to have been correct. These statements involve known and unknown risks and are based upon a number of assumptions and estimates which are inherently subject to significant uncertainties and contingencies, many of which are beyond our control. Actual results may differ materially from those expressed or implied by such forward-looking statements. Important factors that, in our view, could cause actual results to differ materially from those discussed in the forward-looking statements include SEALSQ's ability to implement its growth strategies; SEALSQ's ability to successfully launch post-quantum semiconductor technology; SEALSQ's ability to capture a share of the quantum semiconductor market; the growth of the quantum computing market; SEALSQ's ability to expand its U.S. operations; SEALSQ's ability to enhance its production facilities in the U.S. and France; SEALSQ's ability to make additional investments towards the development of a new generation of quantum-ready semiconductors; the success of SEALCOIN; SEALSQ's ability to continue beneficial transactions with material parties, including a limited number of significant customers; market demand and semiconductor industry conditions; the growth of the quantum computing market; and the risks discussed in SEALSQ's filings with the SEC. Risks and uncertainties are further described in reports filed by SEALSQ with the SEC. SEALSQ Corp is providing this communication as of this date and does not undertake to update any forward-looking statements contained herein as a result of new information, future events or otherwise. Press and Investor Contacts SEALSQ MoreiraChairman & CEOTel: +41 22 594 3000info@ SEALSQ Investor Relations (US)The Equity Group CatiTel: +1 212 836-9611 / lcati@ MurphyTel: +212 836-9612 / kmurphy@
