Latest news with #AmkorTechnology
Business Wire
7 days ago
- Business
- Business Wire
Amkor Technology to Announce Second Quarter 2025 Financial Results on July 28, 2025
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the second quarter of 2025 after the close of trading on the Nasdaq Global Select Market on Monday, July 28, 2025. Amkor management will host a conference call and webcast to review the results on Monday, July 28, 2025, at 5:00 p.m. Eastern Time (ET). To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor's website, located at An archived replay of the webcast will be available after completion of the call. The live call can also be accessed by dialing 1-877-407-4019 or 1-201-689-8337. About Amkor Technology, Inc. Amkor Technology, Inc. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. For more information visit
Yahoo
25-06-2025
- Business
- Yahoo
Amkor Technology, Inc. (AMKR) is Attracting Investor Attention: Here is What You Should Know
Amkor Technology (AMKR) has been one of the most searched-for stocks on lately. So, you might want to look at some of the facts that could shape the stock's performance in the near term. Shares of this chip packaging and test services provider have returned +10.9% over the past month versus the Zacks S&P 500 composite's +5.1% change. The Zacks Electronics - Semiconductors industry, to which Amkor Technology belongs, has gained 15.4% over this period. Now the key question is: Where could the stock be headed in the near term? While media releases or rumors about a substantial change in a company's business prospects usually make its stock 'trending' and lead to an immediate price change, there are always some fundamental facts that eventually dominate the buy-and-hold decision-making. Here at Zacks, we prioritize appraising the change in the projection of a company's future earnings over anything else. That's because we believe the present value of its future stream of earnings is what determines the fair value for its stock. We essentially look at how sell-side analysts covering the stock are revising their earnings estimates to reflect the impact of the latest business trends. And if earnings estimates go up for a company, the fair value for its stock goes up. A higher fair value than the current market price drives investors' interest in buying the stock, leading to its price moving higher. This is why empirical research shows a strong correlation between trends in earnings estimate revisions and near-term stock price movements. For the current quarter, Amkor Technology is expected to post earnings of $0.16 per share, indicating a change of -40.7% from the year-ago quarter. The Zacks Consensus Estimate remained unchanged over the last 30 days. For the current fiscal year, the consensus earnings estimate of $1.18 points to a change of -17.5% from the prior year. Over the last 30 days, this estimate has remained unchanged. For the next fiscal year, the consensus earnings estimate of $1.58 indicates a change of +33.9% from what Amkor Technology is expected to report a year ago. Over the past month, the estimate has remained unchanged. With an impressive externally audited track record, our proprietary stock rating tool -- the Zacks Rank -- is a more conclusive indicator of a stock's near-term price performance, as it effectively harnesses the power of earnings estimate revisions. The size of the recent change in the consensus estimate, along with three other factors related to earnings estimates, has resulted in a Zacks Rank #5 (Strong Sell) for Amkor Technology. The chart below shows the evolution of the company's forward 12-month consensus EPS estimate: Even though a company's earnings growth is arguably the best indicator of its financial health, nothing much happens if it cannot raise its revenues. It's almost impossible for a company to grow its earnings without growing its revenue for long periods. Therefore, knowing a company's potential revenue growth is crucial. For Amkor Technology, the consensus sales estimate for the current quarter of $1.42 billion indicates a year-over-year change of -2.5%. For the current and next fiscal years, $6.11 billion and $6.47 billion estimates indicate -3.2% and +5.9% changes, respectively. Amkor Technology reported revenues of $1.32 billion in the last reported quarter, representing a year-over-year change of -3.2%. EPS of $0.09 for the same period compares with $0.24 a year ago. Compared to the Zacks Consensus Estimate of $1.28 billion, the reported revenues represent a surprise of +3.63%. The EPS surprise was 0%. Over the last four quarters, Amkor Technology surpassed consensus EPS estimates two times. The company topped consensus revenue estimates three times over this period. Without considering a stock's valuation, no investment decision can be efficient. In predicting a stock's future price performance, it's crucial to determine whether its current price correctly reflects the intrinsic value of the underlying business and the company's growth prospects. While comparing the current values of a company's valuation multiples, such as price-to-earnings (P/E), price-to-sales (P/S), and price-to-cash flow (P/CF), with its own historical values helps determine whether its stock is fairly valued, overvalued, or undervalued, comparing the company relative to its peers on these parameters gives a good sense of the reasonability of the stock's price. The Zacks Value Style Score (part of the Zacks Style Scores system), which pays close attention to both traditional and unconventional valuation metrics to grade stocks from A to F (an A is better than a B; a B is better than a C; and so on), is pretty helpful in identifying whether a stock is overvalued, rightly valued, or temporarily undervalued. Amkor Technology is graded A on this front, indicating that it is trading at a discount to its peers. Click here to see the values of some of the valuation metrics that have driven this grade. The facts discussed here and much other information on might help determine whether or not it's worthwhile paying attention to the market buzz about Amkor Technology. However, its Zacks Rank #5 does suggest that it may underperform the broader market in the near term. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Amkor Technology, Inc. (AMKR) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Upturn
16-05-2025
- Business
- Business Upturn
Flip Chip Market Size to Worth USD 48.70 Billion by 2032, Driven by Demand for High-Performance Electronics and Advanced Semiconductor Packaging
Austin, May 16, 2025 (GLOBE NEWSWIRE) — Flip Chip Market Size & Growth Insights: According to the SNS Insider,'The Flip Chip Market Size was worth USD 30.61 billion in 2023 and is expected to grow to USD 48.70 billion by 2032, at a compound annual growth rate (CAGR) of 5.40% over the forecast period from 2024 to 2032.' Rising Demand for Advanced Electronics Accelerates Flip Chip Market Growth The Flip Chip Market is experiencing strong demand, as advanced semiconductor devices are increasingly being integrated into consumer electronics. With the increasing requirement for cost-effective, high-density, energy-efficient, and portable electronic products, like smartphones, tablets, and wearables etc., flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip technology into CPUs, GPUs and chipsets to satisfy the growing demand for higher processing power. And with quick growth of IoT as well as AI enabled devices, there is an urgent demand for advanced interconnection technologies in chips, which also promotes the penetration of flip U.S. market, valued at USD 4.46 billion in 2023, is expected to grow at a CAGR of 5.95%, owing to favorable R&D investments and some of the world's established technological infrastructures. In totality, these factors make flip chip packaging as a required element for global electronics innovation in the coming years. Get a Sample Report of Flip Chip Market Forecast @ Leading Market Players with their Product Listed in this Report are: Amkor Technology –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) Intel Corporation –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) Fujitsu –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) Taiwan Semiconductor Manufacturing Company Limited (TSMC) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) Texas Instruments Incorporated – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) SAMSUNG – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) ASE Technology Holding Co., Ltd. – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) Advanced Micro Devices, Inc. (AMD) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) APPLE INC. – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) Powertech Technology Inc. – (Flip Chip BGA Services, Wafer Level Flip Chip Packaging) Flip Chip Market Report Scope: Report Attributes Details Market Size in 2023 USD 30.61 Billion Market Size by 2032 USD 48.70 Billion CAGR CAGR of 5.40% From 2024 to 2032 Report Scope & Coverage Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook Key Segmentation •By Packaging Technology- ( 3D,2.5D,2.1D)•By Bumping Technology-(Copper Pillar,Tin-Lead Eutectic Solder,Lead-Free Solder,Gold Stud Bumping) •By End-use – (Military and Defense,Medical and Healthcare,Industrial Sector,Automotive,Consumer Electronics,Telecommunications ) Key Drivers • Growing Integration of Advanced Semiconductor Devices in Consumer Electronics Fuels Flip Chip Market Growth. • Emerging Applications in Automotive Electronics and 5G Infrastructure Create Lucrative Opportunities for Flip Chip Technology. Purchase Single User PDF of Flip Chip Market Report (20% Discount) @ Key Industry Segmentation By Packaging Technology In 2023, the 2.5D packaging segment held the largest share of the Flip Chip Market at 45.60%, as it is a cost-effective and allows for the mounting of several dies on an interposer, which provides better thermal and electrical performance. Companies including Intel and AMD serve high-performance processors with 2.5D ICs, and the ASE Group and TSMC are serving AI and data centers with 2.5D solutions. The 3D packaging segment is projected to grow at the highest CAGR of 7.14%, driven by the desire to achieve ultra-high-density integrations in portable consumer devices including smartphones, AR/VR, and AI processors. New technologies, such as Intel's Foveros and Samsung's X-Cube, are enabling faster adoption by enabling reduced size and power while improving performance. By Bumping Technology The Copper Pillar segment led the Flip Chip Market in 2023 with a dominant 61.36% revenue share, driven by its superior electrical performance, thermal management, and fine-pitch capability, making it ideal for high-density applications like processors, FPGAs, and memory devices. Industry players like TSMC and Amkor Technology have advanced their copper pillar bumping technologies to meet growing demands in AI and 5G chip packaging. The Gold Stud Bumping segment is projected to grow at the highest CAGR of 7.79%, owing to the advantages of low-temperature bonding, and lower contamination rate, especially in precision-guided applications such as medical devices, aerospace, and military electronics. By End-use In 2023, Consumer Electronics held the largest revenue share in the Flip Chip Market at 39.64%, driven by rising demand for compact, high-performance devices like smartphones, tablets, and wearables. Flip chip technology enhances processing speed and thermal performance, making it ideal for these applications. Companies like Apple, Samsung, Intel, and ASE Technology continue to adopt and advance flip chip packaging to meet evolving consumer needs. The Automotive segment is set to grow at the highest CAGR of 7.46%, driven by electronics in advanced driver-assistance systems, infotainment, electric vehicle, and autonomous systems. NXP and Infineon are at the forefront of this enabling technology with automotive grade flip chip solutions. Asia Pacific Leads Flip Chip Market While North America Emerges as Fastest-Growing Region In 2023, Asia Pacific dominated the Flip Chip Market with a 42.39% revenue share, due to the existence of big semiconductor manufacturing countries such as Taiwan, South Korea, China, and Japan. Prominent TSM companies such as TSMC, Samsung Electronics, and ASE Technology Riviera further foster innovation in flip chip packaging through their investments in advanced packaging, including high-density production lines. North America is projected to grow at the fastest CAGR of 7.07%, supported by strong R&D investments and increasing demand in AI, automotive, and high-performance computing. Companies like Intel and AMD are advancing next-gen packaging technologies such as EMIB and Foveros, while government initiatives like the CHIPS Act bolster domestic semiconductor production, further accelerating market growth in the region. Do you have any specific queries or need any customized research on Flip Chip Market? Submit your inquiry here @ Recent Developments: In May 2025, Samsung is expected to power the Galaxy Z Flip 7 with its in-house Exynos 2500 chipset. This marks the first use of Exynos in a foldable, replacing the previously expected Snapdragon chip. In May 2025, MediaTek's next-generation flagship SoC and Arm-based processors drive the outsourced semiconductor assembly and test market, helping ASE rake in a year's worth of packaging tool orders in a single quarter. Table of Contents – Major Points 1. Introduction 2. Executive Summary 3. Research Methodology 4. Market Dynamics Impact Analysis 5. Statistical Insights and Trends Reporting 5.1 Technology Adoption Rate (2023) 5.2 Patent Filing Trends (2023) 5.3 Capital Investments (2023) 5.4 Battery Performance Metrics (2023) 5.5 Production Capacity Utilization (2023) 6. Competitive Landscape 7. Flip Chip Market Segmentation, by Packaging Technology 8. Flip Chip Market Segmentation, by Bumping Technology 9. Flip Chip Market Segmentation, by End-Use 10. Regional Analysis 11. Company Profiles 12. Use Cases and Best Practices 13. Conclusion About Us: SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company's aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world. Disclaimer: The above press release comes to you under an arrangement with GlobeNewswire. Business Upturn takes no editorial responsibility for the same.
Yahoo
16-05-2025
- Business
- Yahoo
Flip Chip Market Size to Worth USD 48.70 Billion by 2032, Driven by Demand for High-Performance Electronics and Advanced Semiconductor Packaging
The Flip Chip Market is growing due to rising demand for compact electronics, high-performance devices, and advancements in semiconductor packaging. Austin, May 16, 2025 (GLOBE NEWSWIRE) -- Flip Chip Market Size & Growth Insights: According to the SNS Insider,'The Flip Chip Market Size was worth USD 30.61 billion in 2023 and is expected to grow to USD 48.70 billion by 2032, at a compound annual growth rate (CAGR) of 5.40% over the forecast period from 2024 to 2032.' Rising Demand for Advanced Electronics Accelerates Flip Chip Market Growth The Flip Chip Market is experiencing strong demand, as advanced semiconductor devices are increasingly being integrated into consumer electronics. With the increasing requirement for cost-effective, high-density, energy-efficient, and portable electronic products, like smartphones, tablets, and wearables etc., flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip technology into CPUs, GPUs and chipsets to satisfy the growing demand for higher processing power. And with quick growth of IoT as well as AI enabled devices, there is an urgent demand for advanced interconnection technologies in chips, which also promotes the penetration of flip U.S. market, valued at USD 4.46 billion in 2023, is expected to grow at a CAGR of 5.95%, owing to favorable R&D investments and some of the world's established technological infrastructures. In totality, these factors make flip chip packaging as a required element for global electronics innovation in the coming years. Get a Sample Report of Flip Chip Market Forecast @ Leading Market Players with their Product Listed in this Report are: Amkor Technology –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) Intel Corporation –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) Fujitsu –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) Taiwan Semiconductor Manufacturing Company Limited (TSMC) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) Texas Instruments Incorporated – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) SAMSUNG – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) ASE Technology Holding Co., Ltd. – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) Advanced Micro Devices, Inc. (AMD) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) APPLE INC. – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) Powertech Technology Inc. – (Flip Chip BGA Services, Wafer Level Flip Chip Packaging) Flip Chip Market Report Scope: Report Attributes Details Market Size in 2023 USD 30.61 Billion Market Size by 2032 USD 48.70 Billion CAGR CAGR of 5.40% From 2024 to 2032 Report Scope & Coverage Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook Key Segmentation •By Packaging Technology- ( 3D,2.5D,2.1D)•By Bumping Technology-(Copper Pillar,Tin-Lead Eutectic Solder,Lead-Free Solder,Gold Stud Bumping)•By End-use – (Military and Defense,Medical and Healthcare,Industrial Sector,Automotive,Consumer Electronics,Telecommunications ) Key Drivers • Growing Integration of Advanced Semiconductor Devices in Consumer Electronics Fuels Flip Chip Market Growth.• Emerging Applications in Automotive Electronics and 5G Infrastructure Create Lucrative Opportunities for Flip Chip Technology. Purchase Single User PDF of Flip Chip Market Report (20% Discount) @ Key Industry Segmentation By Packaging Technology In 2023, the 2.5D packaging segment held the largest share of the Flip Chip Market at 45.60%, as it is a cost-effective and allows for the mounting of several dies on an interposer, which provides better thermal and electrical performance. Companies including Intel and AMD serve high-performance processors with 2.5D ICs, and the ASE Group and TSMC are serving AI and data centers with 2.5D solutions. The 3D packaging segment is projected to grow at the highest CAGR of 7.14%, driven by the desire to achieve ultra-high-density integrations in portable consumer devices including smartphones, AR/VR, and AI processors. New technologies, such as Intel's Foveros and Samsung's X-Cube, are enabling faster adoption by enabling reduced size and power while improving performance. By Bumping Technology The Copper Pillar segment led the Flip Chip Market in 2023 with a dominant 61.36% revenue share, driven by its superior electrical performance, thermal management, and fine-pitch capability, making it ideal for high-density applications like processors, FPGAs, and memory devices. Industry players like TSMC and Amkor Technology have advanced their copper pillar bumping technologies to meet growing demands in AI and 5G chip packaging. The Gold Stud Bumping segment is projected to grow at the highest CAGR of 7.79%, owing to the advantages of low-temperature bonding, and lower contamination rate, especially in precision-guided applications such as medical devices, aerospace, and military electronics. By End-use In 2023, Consumer Electronics held the largest revenue share in the Flip Chip Market at 39.64%, driven by rising demand for compact, high-performance devices like smartphones, tablets, and wearables. Flip chip technology enhances processing speed and thermal performance, making it ideal for these applications. Companies like Apple, Samsung, Intel, and ASE Technology continue to adopt and advance flip chip packaging to meet evolving consumer needs. The Automotive segment is set to grow at the highest CAGR of 7.46%, driven by electronics in advanced driver-assistance systems, infotainment, electric vehicle, and autonomous systems. NXP and Infineon are at the forefront of this enabling technology with automotive grade flip chip solutions. Asia Pacific Leads Flip Chip Market While North America Emerges as Fastest-Growing Region In 2023, Asia Pacific dominated the Flip Chip Market with a 42.39% revenue share, due to the existence of big semiconductor manufacturing countries such as Taiwan, South Korea, China, and Japan. Prominent TSM companies such as TSMC, Samsung Electronics, and ASE Technology Riviera further foster innovation in flip chip packaging through their investments in advanced packaging, including high-density production lines. North America is projected to grow at the fastest CAGR of 7.07%, supported by strong R&D investments and increasing demand in AI, automotive, and high-performance computing. Companies like Intel and AMD are advancing next-gen packaging technologies such as EMIB and Foveros, while government initiatives like the CHIPS Act bolster domestic semiconductor production, further accelerating market growth in the region. Do you have any specific queries or need any customized research on Flip Chip Market? Submit your inquiry here @ Recent Developments: In May 2025, Samsung is expected to power the Galaxy Z Flip 7 with its in-house Exynos 2500 chipset. This marks the first use of Exynos in a foldable, replacing the previously expected Snapdragon chip. In May 2025, MediaTek's next-generation flagship SoC and Arm-based processors drive the outsourced semiconductor assembly and test market, helping ASE rake in a year's worth of packaging tool orders in a single quarter. Table of Contents - Major Points 1. Introduction 2. Executive Summary 3. Research Methodology 4. Market Dynamics Impact Analysis 5. Statistical Insights and Trends Reporting 5.1 Technology Adoption Rate (2023) 5.2 Patent Filing Trends (2023) 5.3 Capital Investments (2023) 5.4 Battery Performance Metrics (2023) 5.5 Production Capacity Utilization (2023) 6. Competitive Landscape 7. Flip Chip Market Segmentation, by Packaging Technology 8. Flip Chip Market Segmentation, by Bumping Technology 9. Flip Chip Market Segmentation, by End-Use 10. Regional Analysis 11. Company Profiles 12. Use Cases and Best Practices 13. Conclusion About Us: SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company's aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world. CONTACT: Contact Us: Jagney Dave - Vice President of Client Engagement Phone: +1-315 636 4242 (US) | +44- 20 3290 5010 (UK)Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
29-04-2025
- Business
- Business Wire
Amkor Technology to Present at the J.P. Morgan Global Technology, Media and Communications Conference
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the J.P. Morgan Global Technology, Media and Communications Conference on Tuesday, May 13, 2025. Amkor's presentation will occur at 1:50 pm Eastern Time (10:50 am Pacific Time) in Boston, Massachusetts. A webcast and replay of the presentation will be made available on the Investor Relations section of Amkor's website, located at Management will also be available for one-on-one and small group meetings with investors. About Amkor Technology, Inc. Amkor Technology, Inc. is the world's largest U.S. headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. For more information visit
