Latest news with #Compal
Yahoo
13-06-2025
- Business
- Yahoo
COMPAL Optimizes AI Workloads with AMD Instinct MI355X at AMD Advancing AI 2025 and International Supercomputing Conference 2025
SAN JOSE, Calif., June 12, 2025 /PRNewswire/ -- As AI computing accelerates toward higher density and greater energy efficiency, Compal Electronics (Compal; Stock Ticker: a global leader in IT and computing solutions, unveiled its latest high-performance server platform: SG720-2A/ OG720-2A at both AMD Advancing AI 2025 in the U.S. and the International Supercomputing Conference (ISC) 2025 in Europe. It features the AMD Instinct™ MI355X GPU architecture and offers both single-phase and two-phase liquid cooling configurations, showcasing Compal's leadership in thermal innovation and system integration. Tailored for next-generation generative AI and large language model (LLM) training, the SG720-2A/OG720-2A delivers exceptional flexibility and scalability for modern data center operations, drawing significant attention across the industry. With generative AI and LLMs driving increasingly intensive compute demands, enterprises are placing greater emphasis on infrastructure that offers both performance and adaptability. The SG720-2A/OG720-2A emerges as a robust solution, combining high-density GPU integration and flexible liquid cooling options, positioning itself as an ideal platform for next-generation AI training and inference workloads. Key Technical Highlights: Support for up to eight AMD Instinct MI350 Series GPUs (including MI350X / MI355X): Enables scalable, high-density training for LLMs and generative AI applications. Dual cooling architecture – Air & Liquid Cooling: Optimized for high thermal density workloads and diverse deployment scenarios, enhancing thermal efficiency and infrastructure flexibility. The two-phase liquid cooling solution, co-developed with ZutaCore®, leverages the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, delivering stable and exceptional thermal performance, even in extreme computing environments. Advanced architecture & memory configuration: Built on the CDNA 4 architecture with 288GB HBM3E memory and 8TB/s bandwidth, supporting FP6 and FP4 data formats, optimized for AI and HPC applications. High-speed interconnect performance: Equipped with PCIe Gen5 and AMD Infinity Fabric™ for multi-GPU orchestration and high-throughput communication, reducing latency and boosting AI inference efficiency. Comprehensive support for mainstream open-source AI stacks: Fully compatible with ROCm™, PyTorch, TensorFlow, and more—enabling developers to streamline AI model integration and accelerate time-to-market. Rack compatibility & modular design: Supports EIA 19" and ORv3 21" rack standards with modular architecture for simplified upgrades and maintenance in diverse data center environments. Compal has maintained a long-standing, strategic collaboration with AMD across multiple server platform generations. From high-density GPU design and liquid cooling deployment to open ecosystem integration, both companies continue to co-develop solutions that drive greater efficiency and sustainability in data center operations. "The future of AI and HPC is not just about speed, it's about intelligent integration and sustainable deployment. Each server we build aims to address real-world technical and operational challenges, not just push hardware specs. SG720-2A/ OG720-2A is a true collaboration with AMD that empowers customers with a stable, high-performance, and scalable compute foundation." said Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal. The series made its debut at Advancing AI 2025 and was concurrently showcased at the ISC 2025 in Europe. Through this dual-platform exposure, Compal is further expanding its global visibility and partnership network across the AI and HPC domains, demonstrating a strong commitment to next-generation intelligent computing and international strategic development. For more information, visit the website: AMD, Instinct, ROCm, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners. About Compal Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit View original content to download multimedia: SOURCE COMPAL ELECTRONICS,INC.
Yahoo
20-05-2025
- Business
- Yahoo
Cirrus Logic and Compal Electronics Join Forces to Pioneer AI-Powered Audio Enhancement for Laptops
As laptop manufacturers face persistent challenges with audio distortion and mechanical rattle, two industry leaders are developing an innovative AI solution to transform the PC audio experience. AUSTIN, Texas, May 20, 2025--(BUSINESS WIRE)--Cirrus Logic (Nasdaq: CRUS), a leader in audio engineering and semiconductor innovation, today announced a strategic collaboration with Compal Electronics (Compal; TWSE: 2324), a global leader in electronic design and manufacturing services, to develop AI technology aimed at solving persistent audio quality challenges in laptop computers. The partnership will leverage Cirrus Logic's expertise in audio processing and Compal's manufacturing excellence to address mechanical rattle and audio distortion issues that have long plagued the PC industry. This initiative represents Cirrus Logic's first AI audio technology designed specifically for the PC market, with prototypes scheduled for demonstration at Computex 2025 in Taipei. Solving a Persistent Industry Challenge The collaboration addresses one of the most pervasive yet difficult-to-solve problems in laptop audio: mechanical rattle and distortion. When audio plays at high volumes through laptop speakers, it can cause mechanical components like speakers, keyboards, and chassis elements to vibrate and rattle, resulting in distorted sound and a diminished user experience. Currently, manufacturers typically address this issue by limiting maximum volume or reducing bass frequencies, sacrificing audio performance to prevent distortion. "Today's PC users expect premium audio experiences, but laptop manufacturers face significant engineering challenges in delivering consistent, high-quality sound," said Carl Alberty, Executive Vice President of Cirrus Logic's Mixed-Signal Products. "Our AI-powered audio technology is a huge step forward in ensuring quality audio performance for OEMs, ODMs, and end users. By collaborating with Compal, we're bringing this technology directly to the manufacturing process to catch problems early, significantly enhancing performance, quality and sustainability." AI-Driven Approach to Quality and Consistency This collaboration is significant with the application of AI to address solving audio quality issues. Cirrus Logic's AI tools & rattle limiter algorithms can be used to detect and help reduce rattle, respectively, to deliver quality audio performance. Compal, which manufactures laptops for several global, top-tier brands, will endeavor to build its plan to implement this technology in their production lines, enabling better quality assurance and consistency across high-volume manufacturing. Compal is constantly seeking innovative solutions to improve quality and enhance the products they manufacture for their global partners. Collaboration with Cirrus Logic helps Compal address a long-standing audio quality challenge in the manufacturing process, ultimately delivering superior audio experiences to consumers while reducing production costs associated with inconsistent performance and returns. Benefits Across the PC Ecosystem The new AI audio technology offers multiple benefits throughout the PC ecosystem: For PC Manufacturers (OEMs) The technology allows OEM brands to deliver superior audio experiences without making the traditional trade-offs between loudness and distortion. Manufacturers can confidently push sound performance boundaries while maintaining quality, potentially reducing customer returns related to audio issues. For Manufacturing Partners (ODMs) For ODMs like Compal, the technology streamlines quality testing processes and helps ensure more consistent audio performance across production batches. For End Users Consumers will ultimately benefit from laptop computers that deliver louder, clearer audio with richer bass response without the distraction of mechanical rattle or distortion that diminishes the listening experience. Building on Audio Leadership This initiative builds upon Cirrus Logic's existing Rattle Limiter technology. While the current technology has made significant strides in addressing audio distortion issues, the AI-powered approach represents a major leap forward in effectiveness and adaptability. "This collaboration represents Cirrus Logic's first major AI audio technology for the PC market, but it leverages our decades of experience in audio processing and our extensive patent portfolio," added Alberty. "We're excited to showcase this technology at Computex 2025 and collaborate with additional partners to bring enhanced audio experiences to consumers worldwide." About Cirrus Logic Inc. Cirrus Logic is a leader in low-power, high-precision mixed-signal processing solutions that create innovative user experiences for the world's top mobile and consumer applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Check us out at Cirrus Logic, Cirrus and the Cirrus Logic logo are registered trademarks of Cirrus Logic, Inc. All other company or product names noted herein may be trademarks of their respective holders. About Compal Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal, please visit View source version on Contacts Derrick ShannonAccount Director, Touchdown PRCirrusLogic@ 512.599.4015Julia BettsDirector, Communications & Employee Experience, Cirrus 512.851.4147 Sign in to access your portfolio
Business Wire
20-05-2025
- Business
- Business Wire
Cirrus Logic and Compal Electronics Join Forces to Pioneer AI-Powered Audio Enhancement for Laptops
AUSTIN, Texas--(BUSINESS WIRE)-- Cirrus Logic (Nasdaq: CRUS), a leader in audio engineering and semiconductor innovation, today announced a strategic collaboration with Compal Electronics (Compal; TWSE: 2324), a global leader in electronic design and manufacturing services, to develop AI technology aimed at solving persistent audio quality challenges in laptop computers. The partnership will leverage Cirrus Logic's expertise in audio processing and Compal's manufacturing excellence to address mechanical rattle and audio distortion issues that have long plagued the PC industry. This initiative represents Cirrus Logic's first AI audio technology designed specifically for the PC market, with prototypes scheduled for demonstration at Computex 2025 in Taipei. Solving a Persistent Industry Challenge The collaboration addresses one of the most pervasive yet difficult-to-solve problems in laptop audio: mechanical rattle and distortion. When audio plays at high volumes through laptop speakers, it can cause mechanical components like speakers, keyboards, and chassis elements to vibrate and rattle, resulting in distorted sound and a diminished user experience. Currently, manufacturers typically address this issue by limiting maximum volume or reducing bass frequencies, sacrificing audio performance to prevent distortion. "Today's PC users expect premium audio experiences, but laptop manufacturers face significant engineering challenges in delivering consistent, high-quality sound," said Carl Alberty, Executive Vice President of Cirrus Logic's Mixed-Signal Products. "Our AI-powered audio technology is a huge step forward in ensuring quality audio performance for OEMs, ODMs, and end users. By collaborating with Compal, we're bringing this technology directly to the manufacturing process to catch problems early, significantly enhancing performance, quality and sustainability." AI-Driven Approach to Quality and Consistency This collaboration is significant with the application of AI to address solving audio quality issues. Cirrus Logic's AI tools & rattle limiter algorithms can be used to detect and help reduce rattle, respectively, to deliver quality audio performance. Compal, which manufactures laptops for several global, top-tier brands, will endeavor to build its plan to implement this technology in their production lines, enabling better quality assurance and consistency across high-volume manufacturing. Compal is constantly seeking innovative solutions to improve quality and enhance the products they manufacture for their global partners. Collaboration with Cirrus Logic helps Compal address a long-standing audio quality challenge in the manufacturing process, ultimately delivering superior audio experiences to consumers while reducing production costs associated with inconsistent performance and returns. Benefits Across the PC Ecosystem The new AI audio technology offers multiple benefits throughout the PC ecosystem: For PC Manufacturers (OEMs) The technology allows OEM brands to deliver superior audio experiences without making the traditional trade-offs between loudness and distortion. Manufacturers can confidently push sound performance boundaries while maintaining quality, potentially reducing customer returns related to audio issues. For Manufacturing Partners (ODMs) For ODMs like Compal, the technology streamlines quality testing processes and helps ensure more consistent audio performance across production batches. For End Users Consumers will ultimately benefit from laptop computers that deliver louder, clearer audio with richer bass response without the distraction of mechanical rattle or distortion that diminishes the listening experience. Building on Audio Leadership This initiative builds upon Cirrus Logic's existing Rattle Limiter technology. While the current technology has made significant strides in addressing audio distortion issues, the AI-powered approach represents a major leap forward in effectiveness and adaptability. "This collaboration represents Cirrus Logic's first major AI audio technology for the PC market, but it leverages our decades of experience in audio processing and our extensive patent portfolio," added Alberty. "We're excited to showcase this technology at Computex 2025 and collaborate with additional partners to bring enhanced audio experiences to consumers worldwide." About Cirrus Logic Inc. Cirrus Logic is a leader in low-power, high-precision mixed-signal processing solutions that create innovative user experiences for the world's top mobile and consumer applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Check us out at Cirrus Logic, Cirrus and the Cirrus Logic logo are registered trademarks of Cirrus Logic, Inc. All other company or product names noted herein may be trademarks of their respective holders. About Compal Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal, please visit
Yahoo
18-05-2025
- Business
- Yahoo
Ventiva to Showcase Fan-less Cooling Solution for Compal PCs Up to 45W TDP at Computex 2025
TAIPEI, Taiwan, May 18, 2025--(BUSINESS WIRE)--Ventiva®, the leader in thermal solutions, today announced its ICE9™ thermal management system is being featured in a fan-less Compal laptop concept design at Computex 2025. The 45W TDP (thermal design power) reference design integrates Ventiva's ICE® technology—which cools electronic devices without moving parts, noise, or vibration—and is suitable for high-performance, AI-enabled laptops. "At Compal, we are deeply committed to understanding user needs and anticipating market trends. Our latest generation of AI laptops reflects this vision—delivering industry-leading AI performance in an ultra-slim and silent form factor," said Shikuan Chen, Senior Vice President of Compal Electronics. "By integrating Ventiva's ICE9 thermal management system with our own innovative architecture, we've redefined what's possible in mobile computing. ICE9 eliminates the need for traditional mechanical fans, enabling silent, vibration-free cooling that enhances focus and elevates the user experience to a whole new level." "Designed to meet the demands of next-generation computing, our ICE technology unlocks new possibilities in laptop design, delivering silent, vibration-free cooling while keeping pace with the latest market trends," said Carl Schlachte, Chairman, President and CEO, Ventiva. "With AI driving the future of productivity and creativity, a Compal 45W laptop cooled by our ICE9™ thermal management system highlights what's possible, and how we're enabling our partners to pursue unlimited system innovation across their targeted markets." Ventiva's ICE9 thermal management system is based on the company's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans. The system's enhanced intelligent software control allows the air-cooling solution to act as an advanced air quality detector, detecting and defeating dust and airborne contaminants to ensure optimal system performance in laptop computers and other electronic devices. The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products. About ICE Technology Ventiva's patented ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The ICE9 thermal management system offers a "smart" cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 solution's real-time software can be combined with overall system performance monitoring to provide a robust, device-wide thermal solution. About Ventiva Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company's patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at or follow us on LinkedIn. © 2025, Ventiva, Inc. All rights reserved. VENTIVA, ICE, and ICE9 are trademarks or registered trademarks of Ventiva. Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners. View source version on Contacts Media Contact: Julie
Business Wire
18-05-2025
- Business
- Business Wire
Ventiva to Showcase Fan-less Cooling Solution for Compal PCs Up to 45W TDP at Computex 2025
TAIPEI, Taiwan--(BUSINESS WIRE)-- Ventiva ®, the leader in thermal solutions, today announced its ICE9™ thermal management system is being featured in a fan-less Compal laptop concept design at Computex 2025. The 45W TDP (thermal design power) reference design integrates Ventiva's ICE® technology—which cools electronic devices without moving parts, noise, or vibration—and is suitable for high-performance, AI-enabled laptops. With AI driving the future of productivity and creativity, a Compal 45W laptop cooled by our ICE9 thermal management system highlights what's possible, and how we're enabling our partners to pursue unlimited system innovation across their targeted markets. Share 'At Compal, we are deeply committed to understanding user needs and anticipating market trends. Our latest generation of AI laptops reflects this vision—delivering industry-leading AI performance in an ultra-slim and silent form factor,' said Shikuan Chen, Senior Vice President of Compal Electronics. 'By integrating Ventiva's ICE9 thermal management system with our own innovative architecture, we've redefined what's possible in mobile computing. ICE9 eliminates the need for traditional mechanical fans, enabling silent, vibration-free cooling that enhances focus and elevates the user experience to a whole new level." 'Designed to meet the demands of next-generation computing, our ICE technology unlocks new possibilities in laptop design, delivering silent, vibration-free cooling while keeping pace with the latest market trends," said Carl Schlachte, Chairman, President and CEO, Ventiva. 'With AI driving the future of productivity and creativity, a Compal 45W laptop cooled by our ICE9™ thermal management system highlights what's possible, and how we're enabling our partners to pursue unlimited system innovation across their targeted markets.' Ventiva's ICE9 thermal management system is based on the company's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans. The system's enhanced intelligent software control allows the air-cooling solution to act as an advanced air quality detector, detecting and defeating dust and airborne contaminants to ensure optimal system performance in laptop computers and other electronic devices. The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products. About ICE Technology Ventiva's patented ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The ICE9 thermal management system offers a 'smart' cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 solution's real-time software can be combined with overall system performance monitoring to provide a robust, device-wide thermal solution. About Ventiva Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company's patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at or follow us on LinkedIn. © 2025, Ventiva, Inc. All rights reserved. VENTIVA, ICE, and ICE9 are trademarks or registered trademarks of Ventiva. Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners.
