Latest news with #Intel18A
Yahoo
5 days ago
- Business
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Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its information about the manufacturing technology into a single document. The new 18A production node is expected to deliver significant improvements in power, performance, and area over its predecessor, increasing density by 30% while enhancing performance by 25% or reducing power consumption by 36%.But, perhaps more importantly, 18A will be Intel's first process technology in years that will compete head-to-head with TSMC's leading-edge technology when both enter mass production in the second half of this year. Intel's 18A process node is designed for a wide range of range of products across both client and datacenter applications, and the first Intel's product to use it will be the Panther Lake CPU, which is due to be formally announced later this year. To address different applications, Intel 18A has two libraries: high-performance (HP) with 180nm cell height (180CH) and high-density (HD) with 160nm cell height (160CH) for lower-power applications. Intel 3 vs Intel 4 18A vs Intel 3 Power ? 36% (at 1.1V) - 38% (at 0.75V) Performance 18% (?) 18% (at 0.75V) - 25% (1.1V) Density - 1.3X SRAM Cell Size 0.024 µm² 0.021 µm² Transistor FinFET RibbonFET GAA Power Delivery Front-side PowerVia BSPDN HVM mid-2024 H2 2025 Intel says that compared to Intel 3, its 18A fabrication technology boosts performance by 25%. It manages to achieve this without increasing voltage or circuit complexity when running a typical Arm core sub-block, implemented using a 180CH HD library at 1.1. When operating at the same clocks and 1.1V voltage, it also cuts power usage by 36% compared to the same design on Intel 3. At a reduced voltage of 0.75V, 18A offers an 18% speed increase and uses 38% less energy. Furthermore, designs fabricated on 18A occupy roughly 28% less area than those built with Intel 3. There is a major catch about comparison of voltages between Intel 3 and 18A. The former supports <0.6V, 0.75V, 1.1V, and 1.3V, which makes it particularly suitable for data center devices. This type of workload needs to burst to high clocks, across dozens of cores when demanding peak performance. Then, it'll need to throttle down to a low-power state to save power. To contrast, 18A seems to support 0.4V, 0.75V, and 1.1V, which very good for client PCs and data center CPUs, but may not be ideal for processors that need maximum clock speeds. However, other advantages of Intel's 18A will likely offset the lack of 1.3V support for the vast majority of applications (more on this later). As for SRAM, Intel's 18A process includes a high-density SRAM bit cell measuring 0.021 µm², translating to an SRAM density of roughly 31.8 Mb/mm². This is a major improvement over the 0.024 µm² bit cell used in Intel 4. This puts Intel 18A on par with TSMC's N5 and N3E nodes in terms of SRAM density. However, TSMC's upcoming N2 process goes further, reducing the bit cell to approximately 0.0175 µm² and achieving a higher density of around 38 Mb/mm². Tom's Hardware Intel 7 Intel 4 Intel 3 Intel 18A Contacted Poly Pitch 54nm/60nm 50 nm 50 nm 50 nm Fin Pitch 34 nm 30 nm 30 nm ? M0 Pitch 40 nm 30 nm 30 nm 32 nm High Performance Library Height 408 nm 240 nm 240 nm 180 nm High Density Library Height - - 210 nm 160 nm HP Library Height x CPP 24.4K nm² 12K nm² 12K nm² 9K nm² HD Library Height x CPP - - 10.5K nm² 8K nm² Intel's 18A relies on the company's 2nd generation RibbonFET gate-all-around (GAA) transistors, and a PowerVia backside power delivery network (BSPDN). We investigate exactly how Intel managed to implement GAA transistors and BSPSN below. In GAA transistors, the gate completely wraps around the channel, offering superior electrostatic control compared to FinFETs, which only wrap around on three sides. Such an architecture enables engineers to finely tune device characteristics for either high performance or low power consumption by adjusting the total effective channel width (Weff). This is typically achieved by varying the width and number of stacked nanosheets. More sheets, alongside wider sheets, can increase drive current and performance at the cost of power, while fewer or narrower sheets reduce both performance and power consumption. Intel's 18A RibbonFET transistors feature four nanoribbons and support eight distinct logic threshold voltages (VTs) — four for NMOS, and four for PMOS — spanning a 180mV range. This level of VT granularity is achieved through dipole-based work-function tuning, a method that allows precise control of transistor behavior without altering its physical dimensions. This approach is especially important, given the tight spatial constraints in GAA transistor structures, such as RibbonFETs, where traditional methods, like doping adjustments, are limited. An Intel graph from the paper shows that despite this wide VT range, the transistors exhibit strong electrical characteristics, including steep subthreshold slopes and well-behaved drive currents across both Id–Vg and Id–Vd curves. These results confirm that Intel has successfully maintained device performance and control across the entire VT spectrum, which enables flexible circuit design choices that balance frequency, power, and leakage within the same process. Intel's PowerVia backside power delivery network (BSPDN) relocates power delivery from the top metal layers to the rear side of the chip, creating a physical separation between power and signal wiring. This technique addresses issues like rising resistance in the vertical connections of in the back-end-of-line (BEOL) layers, which in turn enhances transistor efficiency and reduces power usage. Additionally, it prevents signal degradation caused by power interference and allows for tighter packing of logic elements, increasing overall circuit density. Intel's PowerVia delivers power to transistor contacts, which is a slightly less sophisticated approach compared to TSMC's Super Power Rail (coming in 2H 2026 along with A16), which connects directly to each transistor's source and drain. In addition to BSPDN, Intel also implemented its new high-density metal-insulator-metal (MIM) capacitor to enhance power supply stability. Intel has now disclosed the key benefits of its backside power routing. First up, PowerVia increases transistor density by 8% to 10%, which is quite a sizeable part of 18A's overall 1.3X transistor density increase over Intel 3. Secondly, the front-side metal layers in its 18A process achieve approximately 12% better resistance-capacitance (RC) performance and show a 24% to 49% decrease in via resistance compared to Intel 3, thanks to improved metallization techniques and the use of ultra-low-k dielectrics. Thirdly, 18A's PowerVia reduces voltage droop compared to Intel 3 (the worst-case scenario for Intel 3) by up to 10 times. Lastly, BSPDN simplifies chip design as it simplifies the routing of signal and power wires. Since PowerVia is the industry's first backside power delivery network (BSPDN) used in mass production, Intel also presented reliability test results. These demonstrate its long-term durability and chip-package interaction (CPI) performance. According to JEDEC-standard TQV tests, PowerVia passed multiple stress conditions with zero failures, including highly accelerated stress testing at 110°C and 85% humidity for 275 hours, extended high-temperature bake tests up to 1000 hours at 165°C, and 750 cycles of temperature swings from –55°C to 125°C. These results confirm that PowerVia can withstand harsh operating environments, without compromising structural or electrical integrity. In addition to CPI reliability, Intel evaluated the impact of PowerVia on SRAM aging and performance stability. Under conditions equivalent to 1000 hours of high-temperature operation, SRAM arrays maintained stable minimum operating voltage (Vmin) with margin, showing no signs of degradation. This suggests that PowerVia does not negatively affect sensitive on-chip memory and is robust enough to support both digital logic and embedded SRAM under extended stress. Together, these findings are meant to affirm PowerVia's readiness for deployment in high-performance, long-lifecycle computing platforms. In addition to improving performance, reducing power consumption, and enabling higher transistor density, Intel's 18A simplifies production flows and simplifies chip design. By moving power delivery to the backside, Intel eliminates the need for a front-side power grid, which, combined with direct EUV patterning, lowers the total number of masks and simplifies the front-end metal process. By using low-n absorber reticles with tailored dimensional adjustments, Intel also enabled single-pass EUV patterning for the M0–M2 metal layers. This simplification of the lower metal layers reduces process complexity and helps offset the cost of adding extra backside metal layers, which are based on mature, low-cost fabrication techniques. As a result, the overall design process becomes easier and cheaper. In addition, the backside metal layers of 18A's PowerVia are designed for low resistance and high thermal conductivity, which helps manage the increased power density from the GAA transistors. Also, carrier wafer bonding is optimized for heat removal through the backside, addressing the thermal challenges introduced by high-performance transistors. Finally, PowerVia is compatible with advanced packaging methods like Foveros and EMIB, though we already know this from the fact that Panther Lake uses 18A tiles as well as Foveros 3D. Intel's comprehensive technical overview of its 18A process node has highlighted the architecture, performance, and manufacturability improvements that position it as a competitor to TSMC's upcoming N2. The 18A process introduces Intel's second-generation RibbonFET (GAA) transistors and the industry's first mass-production-ready backside power delivery network, PowerVia. Together, these innovations enable up to 25% higher performance or 36% lower power consumption compared to Intel 3, while also increasing transistor density by about 30%. Intel's PowerVia contributes an 8–10% density gain, 12% RC improvement in metal layers, and up to 10 times lower voltage droop. The new node has also passed stringent JEDEC reliability tests, including 1000-hour high-temperature aging and extensive thermal cycling to verify that it can be used for designs meant to work for a long time. Additionally, Intel further streamlined front-end patterning using single-pass EUV at M0–M2, thereby reducing mask counts and simplifying the design. However, whether or not 18A can help Intel restore some of the lustre to its brand remains to be seen, as the company continues to wade its way through rocky waters. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
20-06-2025
- Yahoo
Intel claims 18A, the node Pat bet the company on, is either 25% faster or 38% more efficient than Intel 3. Though that's a node Intel didn't have enough faith in to release for desktops or laptops
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel has been deep diving on its upcoming 18A chip node at the VLSI Symposium in Japan. And if the company's claims are to be believed, 18A is looking pretty sweet. Among other factoids, Intel says it's either up to 25% faster at the same power level, or up to 38% more efficient at the same frequency compared with the Intel 3 node. That's very promising for laptop battery life in particular. Of course, Intel 3 is a node of which we have absolutely zero experience. That's because Intel has never used Intel 3 for a consumer chip, choosing instead to go with TSMC's N3 node for both its Lunar Lake laptop chip and latest Arrow Lake desktop and mobile CPU family, as used for the Intel Core Ultra 9 285K. The most advanced Intel node in the PC is Intel 7, which is a rebrand of Intel's infamous 10nm technology, which ended up arriving the better part of a decade late. Anyway, what to make of these claims from Intel? Specifically and compared to Intel 3, Intel says that in low voltage 0.65 V operation, 18A is either 18% faster or 38% more efficient, while in high voltage 1.1 V mode, it's 25% faster or 36% more efficient. In other words, in low voltage mode you can either run the same clock speed as Intel 3 and use 38% less power, or use the same power and enjoy 18% faster clocks. Meanwhile, in the high performance, high voltage mode, you can choose between either 25% higher clocks for the same power consumption as Intel 3 or the same clocks with 36% lower consumption. Any way you slice it, these are very nice numbers. It's just hard to draw too many conclusions given the scarcity of comparable Intel chips on the Intel 3 node. For now, it's only the Xeon 6 Granite Rapids server CPU, launched earlier this year, that's built on Intel 3. Moreover, the fact that Intel passed over Intel 3 for Lunar Lake and Arrow Lake hardly seems like a vote of confidence in its own manufacturing tech. The point being that Intel also made some bullish claims about Intel 3 and an 18% performance-per-watt increase over Intel 4, but it seems like we'll never get an Intel 3 chip in a PC. What's more, even if these claims are accurate, there's the question of yields. Can Intel actually produce 18A chips at scale? Answers to all these questions will presumably come later this year when the Panther Lake mobile CPU with an 18A CPU die is supposed to be released. If Intel's numbers are accurate, Panther Lake ought to be a much more efficient laptop CPU, enabling clearly improved battery life. At least, that's compared to Intel 3. Exactly how 18A compares with TSMC N3, which is the node used by Intel for Lunar Lake's CPU cores is a separate matter. The takeaway here, then, is that this is all very complicated. Intel has released some very promising numbers. But they involve comparison with another Intel node which itself is only available in a range of server chips and it's unclear how 18A stacks up against TSMC's competing technology. The proof will be in the processing, so to speak, when Panther Lake arrives at the end of this year. It's been a long time coming, but no CPU has ever felt as critical for Intel as Panther Lake.
Yahoo
20-06-2025
- Business
- Yahoo
When Will Intel Reinstate Its Dividend?
Intel slashed its dividend in 2023 and suspended it in 2024 amid mounting financial strain. The balance sheet is loaded with debt, and cash flow is deeply negative as manufacturing investments pile up. The dividend is unlikely to return until Intel stabilizes its product market share, turns the foundry profitable, and reduces its debt load. 10 stocks we like better than Intel › Semiconductor giant Intel (NASDAQ: INTC) slashed its dividend in 2023 and then pulled the plug completely in 2024 amid chronic struggles and weak financial performance. The initial dividend cut helped the company preserve cash as it plowed capital into its manufacturing operations, while the dividend suspension was coupled with significant layoffs and came a few months before former CEO Pat Gelsinger was shown the door. While Intel has a new CEO with plans to aggressively cut costs and streamline operations, the dividend is unlikely to make a comeback any time soon. Intel has spent the past few years investing in new manufacturing facilities and new process technologies in a bid to regain its manufacturing advantage against TSMC and build out a foundry business of its own. This was always going to be a multiyear endeavor that consumed far more cash than it produced in the beginning. Even today, with the Intel 18A process marching toward volume production, the foundry business generates minimal revenue from external customers. This heavy spending occurred just as Intel's products business hit the skids. A severe downturn in PC demand following a pandemic-era boom hurt the client computing business, as did competition from AMD. In the data center segment, strong products from AMD and a shift in spending toward AI accelerators knocked down revenue and decimated profits. The net result of all of this is a balance sheet that has taken a beating. While Intel had around $21 billion in cash and short-term investments at the end of the first quarter of 2025, it also had more than $50 billion in debt. Intel's debt load has been climbing for the past 15 years, rising from next to nothing in 2010 to nearly $30 billion in 2020 and topping $50 billion today. Intel has plenty of cash on hand but needs a big buffer to continue its manufacturing investments and weather an uncertain economic environment. Until Intel's debt is reduced, a dividend is highly unlikely. Intel's products business, which includes all its first-party PC CPUs, server CPUs, and other products, is still profitable. In the first quarter, the products business generated an operating income of $2.9 billion on $11.7 billion in revenue. The problem is the foundry business, which currently generates nearly all its revenue internally from Intel's products business. The foundry business registered an operating loss of $2.3 billion and less than $1 billion in revenue in the first quarter. Add in corporate operating expenses, and Intel produced a total operating loss of $301 million for the quarter. The cash-flow situation looks much worse since Intel's capital spending is vastly outpacing depreciation, thanks to its manufacturing investments. Intel poured more than $5 billion into capital expenditures in the first quarter alone, leading to an adjusted free-cash-flow loss of roughly $3.7 billion. At the moment, Intel's products business isn't generating nearly enough cash to fund the company's ongoing investments. Intel is spinning off and selling off non-core businesses, including the recent sale of a majority stake in Altera, and it reduced its target for gross capital spending in 2025 by $2 billion to $18 billion. Those moves will help the situation, but a rebound in the products business and an influx of external revenue in the foundry business are going to be necessary for the company to even consider restarting its dividend. Under new CEO Lip-Bu Tan, Intel is planning to slash costs, remove layers of middle management, and downsize its workforce. The company is also putting a renewed focus on engineering and listening to its customers, the latter of which will be critical to winning major foundry customers. Intel's first chips using the Intel 18A process will start shipping by the end of this year, potentially ending AMD's manufacturing lead by catching up to TSMC in terms of performance and efficiency. While Intel's turnaround could gain traction in 2026, the dividend isn't likely to return for some time. Intel has a lot of work left to do to stabilize and then grow its CPU market share and still needs to win major foundry customers and ramp up external foundry revenue. Once all that happens, improving the balance sheet and reducing debt should be the top priority. The dividend is probably not a priority right now, and it will likely be years before the company seriously considers restarting dividend payments to investors. Before you buy stock in Intel, consider this: The Motley Fool Stock Advisor analyst team just identified what they believe are the for investors to buy now… and Intel wasn't one of them. The 10 stocks that made the cut could produce monster returns in the coming years. Consider when Netflix made this list on December 17, 2004... if you invested $1,000 at the time of our recommendation, you'd have $658,297!* Or when Nvidia made this list on April 15, 2005... if you invested $1,000 at the time of our recommendation, you'd have $883,386!* Now, it's worth noting Stock Advisor's total average return is 992% — a market-crushing outperformance compared to 172% for the S&P 500. Don't miss out on the latest top 10 list, available when you join . See the 10 stocks » *Stock Advisor returns as of June 9, 2025 Timothy Green has positions in Intel. The Motley Fool has positions in and recommends Advanced Micro Devices, Intel, and Taiwan Semiconductor Manufacturing. The Motley Fool recommends the following options: short August 2025 $24 calls on Intel. The Motley Fool has a disclosure policy. When Will Intel Reinstate Its Dividend? was originally published by The Motley Fool Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
14-05-2025
- Business
- Yahoo
QuickLogic Corp (QUIK) Q1 2025 Earnings Call Highlights: Strategic Partnerships and Revenue ...
Release Date: May 13, 2025 For the complete transcript of the earnings call, please refer to the full earnings call transcript. QuickLogic Corp (NASDAQ:QUIK) secured the first of two EFPGA hard IP contracts for Intel 18A designs, with the second expected in Q4. The company has been recognized as the first available source for EFPGA hard IP for Intel 18A, enhancing its market position. QuickLogic Corp (NASDAQ:QUIK) has been named a partner in the Intel Foundry Accelerator Chilet Alliance, indicating strong industry partnerships. The inclusion of EFPGA hard IP in Faraday's new SOC development platform is expected to generate revenue in the second half of 2025. QuickLogic Corp (NASDAQ:QUIK) anticipates solid revenue growth, non-gap profitability, and positive cash flow for the full year 2025. Revenue guidance for Q2 2025 is lower than anticipated due to a delay in a large IP contract, impacting short-term financial performance. Total revenue for Q1 2025 was down 28% from Q1 2024, indicating a decline in year-over-year performance. Non-gap gross margin in Q1 was significantly lower than previous quarters, affected by cost allocations. The company reported a non-gap net loss of $1.1 million for Q1 2025, compared to a net income in the previous year. QuickLogic Corp (NASDAQ:QUIK) continues to face risks related to market acceptance of new products and intense competition. Warning! GuruFocus has detected 5 Warning Signs with QUIK. Q: Can you discuss the progress and revenue expectations related to Intel 18A and its applications in commercial and defense markets? A: Brian Faith, CEO: We have been working on Intel 18A since we got access to the PDK version 1.0. Our efforts have led to a robust IP core, particularly appealing to the defense industrial base. We anticipate revenue from Intel 18A licenses this fiscal year, with royalties expected next year. The process is considered de-risked, and we are the only provider of EFPGA hard IP for Intel 18A, which is attracting significant interest from both commercial and defense sectors. Q: What are the key drivers for QuickLogic's anticipated revenue growth and profitability in the second half of 2025? A: Brian Faith, CEO: The growth will be driven by new IP contracts, including those related to Intel 18A and strategic radar contracts. These contracts have higher average selling prices compared to previous years. Our automated Australis platform allows us to adapt designs efficiently, supporting this growth with our current team size. Q: Can you elaborate on the storefront opportunities and their potential impact on QuickLogic's business? A: Brian Faith, CEO: We have several storefront opportunities, including the strategic radar contract and a direct-to-storefront contract. We are also exploring new opportunities from the Intel Direct Connect conference. Our EFPGA technology is well-suited for these applications, and we expect these storefront opportunities to contribute significantly to our revenue. Q: How does QuickLogic's technology help reduce costs in the defense market, particularly regarding verification and integration? A: Brian Faith, CEO: Our technology allows for the integration of discrete FPGA functions into a single chip, reducing size, weight, and power (SWaP) requirements. This integration also lowers verification costs by consolidating testing to a single chip, which is crucial for defense applications where multiple chips would otherwise require extensive testing. Q: What is the nature of QuickLogic's partnership with Faraday, and what markets are you targeting together? A: Brian Faith, CEO: Faraday will be the primary interface with customers, focusing on low-power industrial and IoT applications. We support them with use cases and training. The partnership aims to leverage our EFPGA technology in Faraday's SOC development platform, targeting applications that require low power and edge computing capabilities. For the complete transcript of the earnings call, please refer to the full earnings call transcript. This article first appeared on GuruFocus. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
13-05-2025
- Business
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QuickLogic Reports Fiscal First Quarter 2025 Financial Results
SAN JOSE, Calif., May 13, 2025 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK) ("QuickLogic" or the "Company"), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI solutions, today announced its financial results for the fiscal first quarter that ended March 30, 2025. Recent Highlights Delivered design-specific eFPGA Hard IP for Intel 18A customer Test Chip Announced eFPGA integration into Faraday Technology Corporation's FlashKit™-22RRAM SoC Development Platform Awarded $1.4 million Incremental Funding Modification (IFM) for its Strategic Radiation Hardened Program Extended $20 million credit facility maturity date from December 31, 2025 to December 31, 2026 for enhanced operational flexibility "Following significant investments during the last year, we developed and in April, delivered design-specific eFPGA Hard IP for a customer's Test Chip, on Intel 18A," said Brian Faith, CEO of QuickLogic. "We believe that being the first, and currently, only company to offer eFPGA Hard IP for Intel 18A puts us in a very strong position to capitalize on the increasing interest from United States Military, Aerospace, and Government ("USMAG") and commercial companies initiating new designs on Intel 18A technology. With this, the new Faraday Technologies FlashKit™ Development Platform in the market, and several contracts charted for Storefront, we believe our business model is building momentum." Fiscal First Quarter 2025 Financial Results Total revenue from continuing operations for the first quarter of fiscal 2025 was $4.3 million, a decrease of 23.7% compared with the first quarter of 2024 and a decrease of 23.8% compared with the fourth quarter of 2024. New product revenue from continuing operations was approximately $3.7 million in the first quarter of 2025, a decrease of $0.8 million, or 17.4%, compared with the first quarter of 2024 and a decrease of $0.9 million, or 19.1%, compared with the fourth quarter of 2024. The decreases in total revenue and new product revenue from continuing operations from the same period a year ago were mostly due to the timing of awards for certain large eFPGA IP contracts. Mature product revenue from continuing operations was $0.6 million in the first quarter of 2025. This compares to $1.1 million in the first quarter of 2024 and $1.0 million in the fourth quarter of 2024. First quarter 2025 GAAP gross margin from continuing operations was 43.4% compared with 67.1% in the first quarter of 2024 and 62.7% in the fourth quarter of 2024. First quarter 2025 non-GAAP gross margin from continuing operations was 45.6% compared with 72.4% in the first quarter of 2024 and 65.8% in the fourth quarter of 2024. First quarter 2025 GAAP operating expenses from continuing operations were $3.9 million compared with $3.7 million in the first quarter of 2024 and $3.5 million in the fourth quarter of 2024. First quarter 2025 non-GAAP operating expenses from continuing operations were $3.0 million compared with $2.5 million in the first quarter of 2024 and $2.8 million in the fourth quarter of 2024. First quarter 2025 GAAP net loss was ($2.2 million), or ($0.14) per share, compared with net income of $0.1 million, or $0.01 per share, in the first quarter of 2024, and a net loss of ($0.3 million), or ($0.02) per share, in the fourth quarter of 2024. First quarter 2025 non-GAAP net loss was ($1.1 million), or ($0.07) per share, compared with net income of $1.7 million, or $0.12 per share, in the first quarter of 2024, and a net income of $0.6 million, or $0.04 per share, in the fourth quarter of 2024. Conference Call QuickLogic will hold a conference call at 2:30 p.m. Pacific Time / 5:30 p.m. Eastern Time today, May 13, 2025, to discuss its current financial results. The conference call will be webcast on QuickLogic's IR Site Events Page at To join the live conference, you may dial (877) 407-0792 and international participants should dial (201) 689-8263 by 2:20 p.m. Pacific Time. No Passcode is needed to join the conference call. A recording of the call will be available approximately one hour after completion. To access the recording, please call (844) 512-2921 and reference the passcode 13753277. The call recording, which can be accessed by phone, will be archived through May 20, 2025, and the webcast will be available for 12 months on the Company's website. About QuickLogic QuickLogic is a fabless semiconductor company specializing in embedded FPGA (eFPGA) Hard IP, discrete FPGAs, and endpoint AI solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit QuickLogic uses its website ( the company blog ( corporate Twitter account (@QuickLogic_Corp), Facebook page ( and LinkedIn page ( as channels of distribution of information about its products, its planned financial and other announcements, its attendance at upcoming investor and industry conferences, and other matters. Such information may be deemed material information, and QuickLogic may use these channels to comply with its disclosure obligations under Regulation FD. Therefore, investors should monitor the Company's website and its social media accounts in addition to following the Company's press releases, SEC filings, public conference calls, and webcasts. Non-GAAP Financial Measures QuickLogic reports financial information in accordance with United States Generally Accepted Accounting Principles, or U.S. GAAP, but believes that non-GAAP financial measures are helpful in evaluating its operating results and comparing its performance to comparable companies. Accordingly, the Company excludes certain charges related to stock-based compensation, in calculating non-GAAP (i) income (loss) from operations, (ii) net income (loss), (iii) net income (loss) per share, and (iv) gross margin percentage. The Company provides this non-GAAP information to enable investors to evaluate its operating results in a manner like how the Company analyzes its operating results and to provide consistency and comparability with similar companies in the Company's industry. Management uses the non-GAAP measures, which exclude gains, losses, and other charges that are considered by management to be outside of the Company's core operating results, internally to evaluate its operating performance against results in prior periods and its operating plans and forecasts. In addition, the non-GAAP measures are used to plan for the Company's future periods and serve as a basis for the allocation of the Company's resources, management of operations and the measurement of profit-dependent cash, and equity compensation paid to employees and executive officers. Investors should note, however, that the non-GAAP financial measures used by QuickLogic may not be the same non-GAAP financial measures and may not be calculated in the same manner as that of other companies. QuickLogic does not itself, nor does it suggest that investors should, consider such non-GAAP financial measures alone or as a substitute for financial information prepared in accordance with U.S. GAAP. A reconciliation of U.S. GAAP financial measures to non-GAAP financial measures is included in the financial statements portion of this press release. Investors are encouraged to review the related U.S. GAAP financial measures and the reconciliation of non-GAAP financial measures with their most directly comparable U.S. GAAP financial measures. Forward Looking Statements This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, without limitation, statements regarding our future profitability and cash flows, expectations regarding our future business and statements regarding the timing, milestones, and payments related to our government contracts, and statements regarding our ability to successfully exit SensiML, and actual results may differ due to a variety of factors including: delays in the market acceptance of the Company's new products; the ability to convert design opportunities into customer revenue; our ability to replace revenue from end-of-life products; the level and timing of customer design activity; the market acceptance of our customers' products; the risk that new orders may not result in future revenue; our ability to introduce and produce new products based on advanced wafer technology on a timely basis; our ability to adequately market the low power, competitive pricing and short time-to-market of our new products; intense competition by competitors; our ability to hire and retain qualified personnel; changes in product demand or supply; general economic conditions; political events, international trade disputes, natural disasters and other business interruptions that could disrupt supply or delivery of, or demand for, the Company's products; and changes in tax rates and exposure to additional tax liabilities. These and other potential factors and uncertainties that could cause actual results to differ materially from the results contemplated or implied are described in more detail in the Company's public reports filed with the U.S. Securities and Exchange Commission (the "SEC"), including the risks discussed in the "Risk Factors" section in the Company's Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and in the Company's prior press releases, which are available on the Company's Investor Relations website at and on the SEC website at In addition, please note that the date of this press release is May 13, 2025, and any forward-looking statements contained herein are based on management's current expectations and assumptions that we believe to be reasonable as of this date. We are not obliged to update these statements due to latest information or future events. QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such. CODE: QUIK-E –Tables Follow – QUICKLOGIC CORPORATION CONDENSED CONSOLIDATED STATEMENTS OF OPERATIONS (in thousands, except per share amounts) (Unaudited) Three Months EndedMarch 30, 2025 March 31, 2024 December 29,2024Revenue$ 4,325 $ 5,669 $ 5,677Cost of revenue 2,4481,8652,119Gross profit 1,8773,8043,558Operating expenses: Research and development 1,2681,3211,514Selling, general and administrative 2,5362,3512,028Restructuring costs 54——Total operating expense 3,8583,6723,542Operating income (loss) (1,981)13216Interest expense (97)(69)(111)Interest and other (expense) income, net (7)1729Income (loss) before income taxes (2,085)80(66)(Benefit from) provision for income taxes 57(11)Net income (loss) from continuing operations (2,090)73(55)Net income (loss) from discontinued operations, net of taxes and inclusive of $87 in restructuring costs for the three months ended March 30, 2025 (101)35(250)Net income (loss)$ (2,191) $ 108 $ (305)Net income (loss) from continuing operations per share: Basic$ (0.14) $ 0.01 $ 0.00Diluted$ (0.14) $ 0.01 $ 0.00Net income (loss) per share: Basic$ (0.14) $ 0.01 $ (0.02)Diluted$ (0.14) $ 0.01 $ (0.02)Weighted average shares outstanding: Basic 15,29014,17714,869Diluted 15,29014,54514,869 Note: Net income (loss) equals total comprehensive income (loss) for all periods presented. Additionally, the Company notes that income taxes related to discontinued operations were immaterial in nature for the periods presented and as such, only net income (loss) from discontinued operations was reported herein. QUICKLOGIC CORPORATION CONDENSED CONSOLIDATED BALANCE SHEETS (in thousands) (Unaudited)March 30, 2025 December 29,2024ASSETS Current assets: Cash, cash equivalents and restricted cash$ 17,546 $ 21,859Accounts receivable, net of allowance for credit losses of $1 and $0, as of March 30, 2025 and December 29, 2024, respectively 1,5862,426Contract assets 4,1332,682Inventories 905940Prepaid expenses and other current assets 1,1521,666Assets of business held for sale, net 1531Total current assets 25,33729,604Property and equipment, net 17,02815,699Capitalized internal-use software, net 842711Right of use assets, net 687758Intangible assets, net 369378Non-marketable equity investment 300300Inventories, non-current 718718Note receivable, non-current 1,3231,292Other assets 117117Assets of business held for sale, net 2,3562,356TOTAL ASSETS$ 49,077 $ 51,933LIABILITIES AND STOCKHOLDERS' EQUITY Current liabilities: Revolving line of credit$ 15,000 $ 18,000Trade payables 2,6013,097Accrued liabilities 1,1841,587Deferred revenue 701444Notes payable, current 1,7031,928Lease liabilities, current 293284Liabilities of business held for sale —57Total current liabilities 21,48225,397Long-term liabilities: Lease liabilities, non-current 363447Notes payable, non-current 9151,202Total liabilities 22,76027,046Commitments and contingencies Stockholders' equity: Preferred stock, $0.001 par value; 10,000 shares authorized; no shares issued and outstanding ——Common stock, $0.001 par value; 200,000 authorized; 15,824 and 15,336 shares issued and outstanding as of March 30, 2025 and December 29, 2024, respectively 1615Additional paid-in capital 337,888334,268Accumulated deficit (311,587)(309,396)Total stockholders' equity 26,31724,887TOTAL LIABILITIES AND STOCKHOLDERS' EQUITY$ 49,077 $ 51,933 QUICKLOGIC CORPORATION SUPPLEMENTAL RECONCILIATIONS OF US GAAP AND NON-GAAP FINANCIAL MEASURES (in thousands, except per share amounts and percentages) (Unaudited)Three Months EndedMarch 30, 2025 March 31, 2024 December 29,2024US GAAP operating income (loss)$ (1,981) $ 132 $ 16Adjustment for stock-based compensation within: Cost of revenue 95298178Research and development 205199136Selling, general and administrative 636969575Restructuring costs 54——Non-GAAP operating income (loss)$ (991) $ 1,598 $ 905US GAAP net income (loss) from continuing operations$ (2,090) $ 73 $ (55)Adjustment for stock-based compensation within: Cost of revenue 95298178Research and development 205199136Selling, general and administrative 636969575Restructuring costs 54——Non-GAAP net income (loss) from continuing operations$ (1,100) $ 1,539 $ 834US GAAP net income (loss) from discontinued operations$ (101) $ 35 $ (250)Adjustment for stock-based compensation within: Research and development (32)15835Adjustment for restructuring costs 87——Non-GAAP net income (loss) from discontinued operations$ (46) $ 193 $ (215)Non-GAAP net income (loss)$ (1,146) $ 1,732 $ 619US GAAP net income (loss) from continuing operations per share, basic$ (0.14) $ 0.01 $ —Adjustment for stock-based compensation 0.060.100.06Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from continuing operations per share, basic$ (0.07) $ 0.11 $ 0.06US GAAP net income (loss) from discontinued operations per share, basic$ (0.01) $ — $ (0.02)Adjustment for stock-based compensation —0.01—Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from discontinued operations per share, basic$ — $ 0.01 $ (0.02)Non-GAAP net income (loss) per share, basic$ (0.07) $ 0.12 $ 0.04US GAAP net income (loss) from continuing operations per share, diluted$ (0.14) $ 0.01 $ —Adjustment for stock-based compensation 0.060.100.06Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from continuing operations per share, diluted$ (0.07) $ 0.11 $ 0.06US GAAP net income (loss) from discontinued operations per share, diluted$ (0.01) $ — $ (0.02)Adjustment for stock-based compensation —0.01—Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from discontinued operations per share, diluted$ — $ 0.01 $ (0.02)Non-GAAP net income (loss) per share, diluted$ (0.07) $ 0.12 $ 0.04US GAAP gross margin percentage 43.4 % 67.1 % 62.7 % Adjustment for stock-based compensation included in cost of revenue 2.2 % 5.3 % 3.1 % Non-GAAP gross margin percentage 45.6 % 72.4 % 65.8 % QUICKLOGIC CORPORATION SUPPLEMENTAL DATA (Unaudited)Percentage of Revenue Change in RevenueQ1 2025 Q1 2024 Q4 2024 Q1 2025 toQ1 2024 Q1 2025 toQ4 2024COMPOSITION OF REVENUE Revenue by product: (1) New products 87 % 75 % 81 % (17) % (19) % Mature products 13 % 19 % 18 % (49) % (45) % Discontinued Operations: New products — % 6 % 1 % (97) % (61) % Revenue by geography: Asia Pacific 8 % 12 % 10 % (51) % (33) % North America 90 % 78 % 85 % (17) % (20) % Europe 2 % 4 % 5 % (67) % (72) % Discontinued Operations: Asia Pacific — % — % — % — % (60) % North America — % 6 % — % (98) % (67) % Europe — % — % — % 100 % 100 % _____________________ (1) New products include all products manufactured on 180 nanometer or smaller semiconductor processes, eFPGA IP intellectual property, professional services, and QuickAI and SensiML AI software as a service (SaaS) revenue. Mature products include all products produced on semiconductor processes larger than 180 nanometer and includes related royalty revenue. View original content to download multimedia: SOURCE QuickLogic Corporation Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
