Latest news with #LPDDR5x
Mint
08-07-2025
- Mint
Infinix Hot 60 5G+ launching in India on 11 July: Expected price, specs and more
Infinix is planning to launch yet another phone in India, this time catered more towards the budget the segment. The new phone: Infinix Hot 60 5G+ will be making its debut on 11 July with a slim frame and a focus on gaming. Infinix has confirmed that the Hot 60 will be powered by the MediaTek Dimensity 7020 processor and the company is claiming an Antutu score of over 500K on the device. There will be support for up to 12GB of LPDDR5x RAM with the device and the Infinix suite of gaming features will also be availble on it. Infinix also seems to be going the OnePlus and Apple way by including a customizable button on the right hand side of the device. The comany says long pressing on this button will summon its Folax voice assistant. Apart from that, the button will also having the ability to click pictures, start recording, change sound profiles and more. In terms of the design, the Infinix Hot 60 will have a similar design to its predecessor with a vertical camera module and Infinix branding at the bottom. The phone will come in three colourways: Sleek Black, Shadow Blue and Tundra Green. The phone will possess a thickness of 7.8mm which is a major selling point for the Transsion sub-brand. As for the pricing, the Infinix Hot 50 launched at a starting price of ₹ 9999 in India which suggests that the Hot 60 could come at a similar price bracket. Moreover, if the price of the phone is any higher than this, it would undercut other devices from Infinix itself like the Note 50x and Note 50s. While there is still sometime to go for the sale of the Note 60, Infinix has already announced that the buyers of this device will get free Infinix XE 23 TWS complementary.
The Hindu
15-05-2025
- The Hindu
Qualcomm launches Snapdragon 7 Gen 4 mobile platform for mid-tier smartphones
Qualcomm on Thursday (May 15, 2025) launched the Snapdragon 7 Gen 4 mobile platform capable of handling gen AI tasks as well. It succeeds the Snapdragon 7 Gen 3 mobile processor and is likely to power the mid-tier smartphones. The Snapdragon 7 Gen 4 mobile platform claims a 27% increase in CPU performance, 30% faster GPU renderings, and a 65% improvement to AI performance over its predecessor mobile platform. Snapdragon 7 Gen 4 is able to support Wi-Fi 7 and Bluetooth 6.0. Built upon the 4nm process, the Snapdragon 7 Gen 4 mobile platform can offer UFS storage from 2 to UFS 4.0. It is also capable of holding up to LPDDR5x RAM. (For top technology news of the day, subscribe to our tech newsletter Today's Cache) The Snapdragon 7 Gen 4 has 1 Prime core of up to 2.8 GHz, 4 Performance cores of up to 2.4 GHz and 3 Efficiency cores of up to 1.8 GHz. The new mobile platform comes with the first-ever support for Qualcomm Expanded Personal Area Network (XPAN) technology. Smartphones running Snapdragon 7 Gen 4 are expected to launch this month.
Techday NZ
21-04-2025
- Business
- Techday NZ
Adlink unveils compact module for high-power edge computing
ADLINK Technology has launched its COM-HPC-mMTL module based on Intel Core Ultra architecture, targeting edge computing applications requiring compact solutions with high computing power. The new module features up to 14 CPU cores, 8 Xe GPU cores, and an integrated Neural Processing Unit (NPU) designed to deliver both high performance and energy efficiency. The COM-HPC-mMTL is designed for use in edge environments such as industrial automation, data logging, unmanned aerial vehicles (UAVs), portable medical ultrasound systems, and AI-enabled robotics. According to ADLINK, the module integrates up to 64GB of LPDDR5x memory—soldered directly onto the board and operating at speeds as high as 7467MT/s. The device's footprint measures just 95mm by 70mm, enabling its deployment in constrained spaces. Selected versions are specified for operating in temperatures ranging from -40°C to 85°C, supporting deployment in a variety of demanding settings. In terms of connectivity and input/output options, the COM-HPC-mMTL incorporates up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, as well as multiple DDI/USB4 and USB 3.0/2.0 interfaces. These interfaces are designed to accommodate data-intensive tasks and high throughput requirements typical of modern edge computing workloads. Alex Wang, Senior Product Manager at ADLINK, said, "The COM-HPC-mMTL is not just another embedded module. It redefines what's possible in edge computing with its exceptional performance and efficiency in such a compact form." The company stated that the module addresses requirements from customers who need a combination of strong computational capability, space efficiency, and ruggedness. The form factor is intended to enable stackable designs, which the company says helps maximise space efficiency without reducing functionality. This approach enables developers and manufacturers to integrate the module into compact or portable devices where space and energy constraints are a critical issue. ADLINK cited high-performance, battery-powered devices as one of the key target areas for the COM-HPC-mMTL, in line with industry trends toward more mobile, intelligent systems capable of functioning effectively at the network edge. For those seeking to accelerate product development, ADLINK will make available the COM-HPC-mMTL development kit in the second half of 2025. The kit is intended to help developers prototype and test their solutions using the new module. The COM-HPC-mMTL is positioned as a product that brings together processing power, compact size, scalability and a level of connectivity that supports next-generation applications in edge computing. The module is designed for use in a range of sectors where densification of computing resources and localised AI processing are becoming increasingly essential. Follow us on: Share on:
