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Yahoo
01-07-2025
- Business
- Yahoo
Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration
Single- and Dual-Core MCUs Combine Arm Cortex-M85 and M33 Cores with Arm Ethos-U55 NPU to Deliver Superior AI Performance up to 256 GOPs Unprecedented 7300+ CoreMarks1 with Dual Arm CPU cores TSMC 22ULL Process Delivers High Performance and Low Power Consumption Embedded MRAM with Faster Write Speeds and Higher Endurance and Retention Dedicated Peripherals Optimized for Vision and Voice AI plus Real-Time Analytics New AI Software Framework Eases Development and Enables Easy Migration with MPUs Leading-Edge Security Features Ensure Data Privacy TOKYO, July 01, 2025--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm® Cortex®-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz. Designed for Edge/Endpoint AI The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own. Advanced Technology The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash. "There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend," said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. "The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications." "The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device," said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. "By building on the advanced AI capabilities of the Arm compute platform, Renesas' RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences." "It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices," said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. "As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices." Robust, Optimized Peripheral Set for AI Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications. The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications. New RUHMI Framework Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas's own e2 Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs. Advanced Security Features The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution. Ready to Use Solutions Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page. Key Features of the RA8P1 MCUs Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional) Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timers Security: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management Packages: 224BGA, 289BGA Winning Combinations Renesas has combined the new RA8P1 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Video Conferencing Camera with AI Capabilities, AI Drawing Robot Arm and AI-Enabled Surveillance Camera. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RA8P1 MCUs are available now. Renesas is also shipping an RA8P1 Evaluation Kit. More information is available at Samples and kits can be ordered either on the Renesas website or through distributors. Renesas MCU Leadership A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry's most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube and Instagram. (Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. ___________________________ 1 EEMBC's CoreMark® benchmark measures performance of MCUs and CPUs used in embedded systems. View source version on Contacts Media Contacts: Americas Don ParkmanRenesas Electronics Corporation+
Business Wire
01-07-2025
- Business
- Business Wire
Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm ® Cortex ® -M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz. Designed for Edge/Endpoint AI The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own. Advanced Technology The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash. 'There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend,' said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. 'The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications.' 'The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device,' said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. 'By building on the advanced AI capabilities of the Arm compute platform, Renesas' RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences.' 'It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices,' said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. 'As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices.' Robust, Optimized Peripheral Set for AI Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I 2 S and PDM support microphone inputs for voice AI applications. The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications. New RUHMI Framework Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas's own e 2 Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs. Advanced Security Features The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone ®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution. Ready to Use Solutions Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page. Key Features of the RA8P1 MCUs Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional) Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timers Security: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management Packages: 224BGA, 289BGA Winning Combinations Renesas has combined the new RA8P1 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Video Conferencing Camera with AI Capabilities, AI Drawing Robot Arm and AI-Enabled Surveillance Camera. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RA8P1 MCUs are available now. Renesas is also shipping an RA8P1 Evaluation Kit. More information is available at Samples and kits can be ordered either on the Renesas website or through distributors. Renesas MCU Leadership A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry's most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube and Instagram. (Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Yahoo
19-05-2025
- Science
- Yahoo
Magnetic Force Microscope (MFM) Market Outlook, Innovations and Growth Trends Through 2034
Magnetic Force Microscope (MFM) Market Overview and Outlook 2025-2034 Luton, Bedfordshire, United Kingdom, May 19, 2025 (GLOBE NEWSWIRE) -- The global magnetic force microscope (MFM) market is projected to grow significantly, rising from a value of approximately USD 356 million in 2024 to over USD 798 million by 2034, reflecting a robust compound annual growth rate (CAGR) of 8.4%. Magnetic force microscopy is an advanced scanning probe technique used to map magnetic domains at the nanoscale, offering unmatched sensitivity and resolution for both industrial and academic research applications. MFMs are especially crucial in nanotechnology, magnetic material research, data storage, spintronics, and biomedical fields. Get a Sample PDF Brochure: The evolution of high-resolution imaging, precision scanning mechanisms, and improved force spectroscopy capabilities is expanding the applicability of MFM across emerging markets and interdisciplinary sciences. Increasing investments in nanotechnology research and development, growing demand for miniaturized electronics, and the global push for precision metrology are fueling this market's upward trajectory. Market Dynamics Key Growth Drivers Boom in Nanotechnology and Spintronics Research: As researchers delve deeper into spin-based electronics and nanoscale magnetic materials, MFMs have become indispensable tools for non-destructive, high-resolution magnetic imaging. Advancements in Data Storage Technologies: The shift toward high-capacity and energy-efficient data storage devices, such as magnetic memory and MRAM (Magnetoresistive Random Access Memory), is driving demand for MFMs in testing and prototyping. Increased Research Funding in Academia: Government and institutional grants across North America, Europe, and Asia-Pacific support the adoption of high-end magnetic force microscopes in universities and research labs. Growing Use in Biomedical and Bioscience Fields: MFM is increasingly used for characterizing magnetically labeled biological samples and studying the interaction of magnetic nanoparticles with cells and tissues. Rise of Semiconductor Miniaturization: The global semiconductor industry requires precise surface and domain characterization for integrated circuit components and ferromagnetic thin films, where MFMs provide atomic-level insights. Challenges and Restraints High Equipment Cost: The cost of standard and high-resolution MFMs, including operation and maintenance, remains a significant barrier to entry, particularly for small-scale labs or institutions in developing nations. Steep Learning Curve: MFM operation requires a high level of expertise in nanoscale imaging, often necessitating specialized training for accurate data acquisition and interpretation. Environmental Sensitivity: External vibrations, temperature fluctuations, and electromagnetic interference can affect measurement accuracy, necessitating controlled laboratory environments. Opportunities Development of Portable and User-Friendly MFMs: Advances in hardware miniaturization and intuitive software interfaces are opening the door for compact MFMs in field-based or mobile labs. Integration with Other Imaging Modalities: Combining MFM with atomic force microscopy (AFM), near-field microscopy, or Raman spectroscopy enhances its utility in hybrid imaging systems. Emerging Applications in Quantum Material Studies: The analysis of exotic quantum phases, topological insulators, and 2D materials benefits greatly from MFM due to its localized detection capabilities. Buy Now : Market Segmentation By Product Type Standard Magnetic Force Microscope: These are widely used in academic and research settings for routine magnetic domain imaging. Standard MFMs typically offer nanometer-scale resolution and compatibility with a variety of scanning modes. High-Resolution Magnetic Force Microscope: Featuring advanced cantilevers and feedback systems, these instruments are designed for applications that demand sub-nanometer resolution and ultra-sensitive force measurements. High-resolution MFMs are predominantly adopted in semiconductor, quantum computing, and materials science research. By Application Materials Science: MFM is widely used to study ferromagnetic and multiferroic materials, thin films, superconductors, and nano-composites. It supports surface defect analysis, domain wall characterization, and micromagnetic simulation validation. Biology: MFMs are used in combination with magnetic nanoparticles for targeted drug delivery research, bio-imaging, and cellular interaction analysis. Their non-invasive nature is valuable in live-cell monitoring. Nanotechnology: MFM plays a central role in nanofabrication and device testing. Researchers employ it to inspect spin valves, magnetic tunnel junctions, and nanowires used in nanoscale logic devices. By End User Academic Institutes: Universities and public research organizations constitute a major portion of the MFM market, using these tools for training, thesis work, and cutting-edge research across physics, chemistry, and engineering disciplines. Research Laboratories: Government and private R&D institutions use MFMs to investigate new materials, optimize industrial processes, and explore novel magnetoelectric devices. Industrial Sector: Semiconductor companies, nanotech firms, and electronics manufacturers deploy MFMs for defect analysis, quality control, and precision material diagnostics during production and prototyping. By Technology Scanning Probe Microscopy (SPM): MFMs are derived from atomic force microscopy, operating by detecting magnetic forces via a magnetized cantilever. SPM-based MFMs offer high spatial resolution and multiple scan modes for 2D and 3D imaging. Force Spectroscopy: This technique involves analyzing the force-distance curve to assess mechanical, magnetic, or adhesive properties at specific points on a sample's surface. MFM-enhanced force spectroscopy helps study domain-specific magnetic interactions in greater detail. By Distribution Channel Direct Sales: Most high-end and customized MFM instruments are sold directly by manufacturers to institutions and industrial clients, often involving pre-sale consultation, site installation, and training services. Online Retail: A growing channel for accessories, probes, and lower-cost or modular MFM units. Online platforms are increasingly used by educational labs and SMEs looking for cost-effective solutions. Browse full Report - Regional Insights North America: North America dominates the global market, led by the U.S., where a strong academic ecosystem and extensive R&D infrastructure support the adoption of advanced scientific instruments. Government funding through the National Science Foundation (NSF) and National Institutes of Health (NIH) also drives demand. Europe: Germany, the UK, and France are major contributors, with established expertise in precision instrumentation and materials research. Horizon Europe initiatives and university-industry collaborations foster growth. Asia-Pacific: China, Japan, South Korea, and India are emerging as manufacturing and research hubs for advanced microscopy tools. Expanding semiconductor production and nanotech startups are bolstering MFM sales. Latin America: Brazil and Mexico show gradual adoption in universities and research agencies. Growth is also seen in petrochemical and mining sectors investing in materials characterization. Middle East & Africa: Countries like the UAE and South Africa are investing in science parks and innovation centers that include advanced microscopy facilities. Opportunities exist through educational partnerships and technology grants. Competitive Landscape The global MFM market features a competitive mix of long-established microscopy firms and specialized nanotech equipment providers. Companies compete on resolution capabilities, modular design, integration options, and after-sales support. Key Market Players Include: Bruker Corporation: A global leader in atomic force and magnetic force microscopy, known for its Dimension Icon and FastScan systems. NT-MDT Spectrum Instruments: Offers high-resolution and multi-functional SPM/MFM systems for academic and industrial users. Asylum Research (Oxford Instruments): Focuses on user-friendly and customizable probe microscopy platforms for advanced research. Nanosurf AG: Provides compact and portable MFM tools for educational and industrial use. Keysight Technologies: Specializes in high-end SPM systems with advanced force spectroscopy and imaging capabilities. Strategic Developments: Launch of AI-driven image processing software for real-time defect recognition. Expansion into Asia-Pacific through regional partnerships and demo labs. Custom probe development for niche applications like bio-MFM and magnetic semiconductor inspection. Emerging Trends Hybrid Imaging Solutions: Integration of MFM with Raman, SEM, or photothermal systems for multi-dimensional analysis. AI and Machine Learning in MFM: Predictive analytics and noise filtration algorithms are streamlining image clarity and interpretation. Miniaturized MFMs: Desktop and benchtop systems for field analysis and undergraduate labs are expanding accessibility. Cryogenic and High-Temperature MFMs: Used in quantum computing and superconductivity research to observe magnetic behavior under extreme conditions. This report is also available in the following languages : Japanese (磁気力顕微鏡市場), Korean (자기력 현미경 시장), Chinese (磁力显微镜市场), French (Marché des microscopes à force magnétique), German (Markt für Magnetkraftmikroskope), and Italian (Mercato dei microscopi a forza magnetica), etc. Download Full PDF Sample Copy of Market Report @ Related Reports Light Pipe Kits Market The global light pipe kits market is poised to reach a value of approximately $1.2 billion in 2024, with projections indicating growth to about $2.3 billion by 2034. This growth represents a Compound Annual Growth Rate (CAGR) of 7.1% during the forecast period from 2025 to 2034. 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Portable Anechoic Chambers (PACs) Market The global market for Portable Anechoic Chambers (PACs) is valued at approximately $150 million, driven primarily by the increasing demand for sound testing in sectors such as automotive, aerospace, and electronics. The market is projected to grow significantly, reaching an estimated value of $250 million by 2034. This growth represents a compound annual growth rate (CAGR) of roughly 5.2% during the forecast period from 2025 to 2034. Filter Wheels Market The global filter wheels market is currently valued at approximately $275 million in 2024, with projections indicating a significant growth trajectory, positioning the market value at around $480 million by 2034. This represents a robust Compound Annual Growth Rate (CAGR) of 6.1% during the forecast period from 2025 to 2034. Vacuum Gauges for Can Market The global vacuum gauges market is projected to reach approximately $1.5 billion in 2024, driven by the increasing demand for precise measurement instruments across industries such as semiconductor manufacturing, chemical processing, and aerospace. The market is anticipated to grow at a compound annual growth rate (CAGR) of 6.5% from 2025 to 2034, reaching an estimated value of $2.8 billion by the end of the forecast period. Excimer Laser Mirror Market The global excimer laser market is valued at approximately $1.2 billion in 2024, with growth driven by increasing demand across ophthalmic procedures, semiconductor manufacturing, and materials processing. The market is projected to reach around $2.5 billion by 2034, reflecting a Compound Annual Growth Rate (CAGR) of 7.7% during the forecast period from 2025 to 2034. CONTACT: Contact Data Irfan Tamboli (Head of Sales) Phone: + 1704 266 3234 Email: sales@ in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
13-05-2025
- Business
- Business Wire
Everspin Technologies to Present at the Ladenburg Technology Innovation Expo25
CHANDLER, Ariz.--(BUSINESS WIRE)--Everspin Technologies Inc., (NASDAQ: MRAM), the market leader in MRAM, announced that Sanjeev Aggarwal, President and Chief Executive Officer, and Bill Cooper, Chief Financial Officer, will present at the Ladenburg Technology Innovation Expo25, on May 21 st at 9:30 a.m. Eastern Time. About Everspin Technologies Everspin Technologies, Inc. is the world's leading provider of Magnetoresistive RAM (MRAM). Everspin MRAM delivers the industry's most robust, highest performance non-volatile memory for Industrial IoT, Data Center, and other mission-critical applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin provides commercially available MRAM solutions to a large and diverse customer base. For more information, visit NASDAQ: MRAM.
Yahoo
01-05-2025
- Business
- Yahoo
Everspin Technologies Inc (MRAM) Q1 2025 Earnings Call Highlights: Surpassing Revenue ...
Revenue: $13.1 million, above guidance range of $12 million to $13 million. Non-GAAP EPS: $0.02 per diluted share. MRAM Product Sales: $11.0 million. Licensing, Royalty, Patent, and Other Revenue: $2.1 million, down from $3.6 million in Q1 2024. GAAP Gross Margin: 51.4%, down from 56.5% in Q1 2024. GAAP Operating Expenses: $8.7 million. Non-GAAP Net Income: $0.4 million. Cash and Cash Equivalents: $42.2 million. Cash Flow from Operations: $1.4 million. Q2 2025 Revenue Guidance: $12.5 million to $13.5 million. Q2 2025 GAAP Net Loss Guidance: Between $0.05 loss and breakeven per basic share. Q2 2025 Non-GAAP Net Income Guidance: Between breakeven and $0.05 per basic share. Warning! GuruFocus has detected 4 Warning Signs with MRAM. Release Date: April 30, 2025 For the complete transcript of the earnings call, please refer to the full earnings call transcript. Everspin Technologies Inc (NASDAQ:MRAM) reported first-quarter revenue of $13.1 million, exceeding their guidance range. The company achieved a non-GAAP EPS of $0.02, surpassing expectations. Everspin continues to see strong product revenue, particularly from the PERSYST 1-gigabit STT-MRAM used in data center applications. The company is involved in significant projects with major automotive and aerospace clients, including Lucid Motors and Blue Origin. Everspin's balance sheet remains strong and debt-free, with cash and cash equivalents of $42.2 million. Licensing, royalty, patent, and other revenue decreased to $2.1 million from $3.6 million in Q1 2024. Gross margin decreased to 51.4% from 56.5% in Q1 2024 due to a lower mix of high-margin licensing revenue. The company anticipates a non-GAAP net loss per basic share between $0.05 and breakeven for Q2 2025. Everspin's revenue is expected to be more heavily weighted towards the second half of 2025, indicating potential short-term challenges. There is uncertainty regarding potential tariff impacts, particularly concerning products manufactured in the US and shipped to China. Q: Can you explain the potential impact of tariffs on your second-quarter guidance, especially concerning China? A: William Cooper, Chief Financial Officer, explained that while some wafers are sourced from GlobalFoundries in Germany and others from the US and Taiwan, direct sales to China are minimal. Therefore, the impact of tariffs is expected to be low. Most products are assembled in Taiwan, and the importer would be responsible for tariffs. Q: Are you seeing signs of a cyclical recovery in the industrial segment of your business? A: William Cooper, Chief Financial Officer, confirmed that there are signs of improvement in backlog and traction on STT-MRAM products, indicating a potential cyclical recovery in the industrial segment. Q: Can you provide insights into the gross margin dynamics and expectations for the rest of the year? A: William Cooper, Chief Financial Officer, noted that the gross margin was consistent between Q4 and Q1 at around 51%. He expects this consistency to continue throughout the year, maintaining a 50-plus gross margin. Q: What factors are contributing to the expected second-half weighting of revenue in 2025? A: Sanjeev Aggarwal, President and CEO, mentioned that the backlog is building up, and there is a conversion of design wins into early production for STT products. This, along with the bottoming out of inventory correction, supports the expectation of higher revenue in the second half of 2025. Q: How should we view operating expenses for the rest of the year? A: William Cooper, Chief Financial Officer, indicated that operating expenses are expected to remain in the same range throughout the year, with some product development work contributing to the expenses. For the complete transcript of the earnings call, please refer to the full earnings call transcript. This article first appeared on GuruFocus.
