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Yahoo
17-06-2025
- Automotive
- Yahoo
Leading-Edge Semiconductor Technology Market is expected to reach USD 1 trillion by 2034
Leading-Edge Semiconductor Technology Market Outlook 2025–2034 Luton, Bedfordshire, United Kingdom, June 17, 2025 (GLOBE NEWSWIRE) -- The global leading-edge semiconductor technology market is undergoing a significant transformation, valued at approximately USD 500 billion in 2024. Forecasts suggest the market will nearly double, reaching around USD 1 trillion by 2034. This remarkable expansion corresponds to a compound annual growth rate (CAGR) of approximately 7.3% over the forecast period (2025–2034). This growth is driven by the increasing demand for advanced electronic components across applications such as artificial intelligence (AI), cloud computing, automotive technologies, and smart devices. Download PDF Brochure: Semiconductors play a pivotal role in powering high-performance computing and next-generation connectivity solutions. The rapid shift toward miniaturization, energy efficiency, and high-speed performance is pushing the development of technologies like FinFET, Silicon-On-Insulator (SOI), Gallium Nitride (GaN), and Silicon Carbide (SiC), making them central to the competitive landscape of the industry. Market Segmentation Insights The market can be broadly segmented based on product type, application, end user, technology, and distribution channels. Among product types, transistors, diodes, integrated circuits (ICs), and sensors are witnessing substantial demand due to their utility in modern electronics. In particular, integrated circuits and sensors are essential for enabling smart functionalities in consumer electronics and automotive systems. In terms of applications, the consumer electronics segment dominates, capturing nearly 30% of the market share. This is attributed to the surge in smart devices, wearables, and connected home systems. Automotive applications are also growing rapidly, supported by the global transition to electric vehicles (EVs) and autonomous driving technologies. These systems require advanced driver-assistance systems (ADAS), power electronics, and robust communication protocols—all of which rely heavily on cutting-edge semiconductors. From an end-user perspective, consumer electronics manufacturers account for the largest share, followed by automotive manufacturers and telecommunications companies. Other end users include industrial automation players and cloud service providers, who are integrating high-performance chips to meet the demands of IoT and edge computing. Technology Node and Material Trends A key aspect of the semiconductor industry lies in its technology node advancements. Smaller nodes like 5nm and below represent a significant share of the market and are crucial for powering high-end smartphones, processors, and GPUs. These nodes offer greater performance while consuming less power. Meanwhile, nodes like 7nm and 10nm are preferred for a variety of computing applications, balancing power efficiency with cost. However, older nodes such as 14nm and 28nm remain relevant, particularly for legacy systems and cost-sensitive devices. Regarding semiconductor materials, silicon remains the most commonly used substrate, accounting for about 60% of the total market due to its established fabrication processes and scalability. However, compound semiconductors such as GaN and SiC are gaining popularity, especially in high-frequency, high-voltage, and high-temperature applications. These materials are particularly suitable for electric vehicles, telecommunications infrastructure, and aerospace systems. Browse full Report - Market Segmentation By Type of Semiconductor - Analog Semiconductors - Digital Semiconductors - Mixed-Signal Semiconductors By Application - Consumer Electronics - Automotive - Telecommunications - Data Centers - Industrial Automation - Internet of Things (IoT) By Material - Silicon - Gallium Nitride (GaN) - Silicon Carbide (SiC) - Other Semiconductors By Product - Microcontrollers - Processors - Memory Chips - Logic Devices By Technology Node - 5nm and below - 7nm - 10nm - 14nm - 28nm and above By End-User - Consumer Electronics Manufacturers - Automotive Manufacturers - Telecommunication Companies - Industrial Players - Cloud Service Provider Regional Market Landscape The Asia-Pacific region leads the global market, contributing approximately 45% of total revenue in 2024. Countries like China, South Korea, and Japan are at the forefront, benefiting from strong electronics manufacturing ecosystems, favorable government incentives, and local demand for consumer electronics. Taiwan, home to the world's largest contract chipmaker TSMC, plays a critical role in driving semiconductor innovation and production capacity. North America follows, holding around 30% of the market. The region benefits from a robust presence of industry leaders like Intel, NVIDIA, AMD, and Qualcomm, alongside a thriving startup ecosystem and substantial R&D investment. The growing adoption of AI, cloud infrastructure, and 5G is further boosting demand for semiconductors in the United States and Canada. Europe contributes about 20% to the global semiconductor market. The region is emphasizing self-sufficiency through initiatives like the European Chips Act, aiming to reduce reliance on Asia for critical technologies. Although Europe faces fragmentation in terms of regulations, it is making progress through strategic alliances and increased investment in domestic production. Emerging regions like Latin America, the Middle East, and Africa are witnessing gradual growth due to increased digitization, infrastructure modernization, and investments in industrial automation. However, these markets face challenges related to technological adoption, skilled labor availability, and geopolitical instability. Market Drivers and Opportunities Several factors are propelling the growth of the leading-edge semiconductor market. One major driver is the accelerated demand for computing power in data centers, artificial intelligence applications, and cloud platforms. These use cases require high-performance processors, memory chips, and logic devices, all of which are critical components in the semiconductor supply chain. The automotive sector represents a burgeoning opportunity, especially with the shift toward EVs and autonomous vehicles. These cars require complex chips for battery management, connectivity, safety systems, and in-vehicle infotainment. As electric mobility expands globally, the demand for advanced semiconductors will continue to surge. Other growth areas include the Internet of Things (IoT) and 5G infrastructure. The proliferation of connected devices—from smart homes to industrial automation—relies on energy-efficient and compact chips. Additionally, the rollout of 5G networks is pushing telecom companies to upgrade their equipment, further stimulating the semiconductor market. Collaborative partnerships and vertical integration are also gaining momentum. Companies are investing in joint ventures to reduce R&D costs and share technological know-how, enhancing competitiveness and accelerating time-to-market for innovative solutions. Challenges and Market Restraints Despite the strong growth outlook, the market faces several challenges. Supply chain disruptions—exacerbated by geopolitical tensions and global pandemics—have significantly impacted chip availability and production timelines. The overreliance on specific regions, particularly in Asia, leaves the global supply chain vulnerable to shocks. Additionally, the cost of R&D and semiconductor fabrication remains high. Building advanced fabs can require investments exceeding billions of dollars, which may deter new entrants and limit competition. Smaller firms struggle to compete with established players that possess massive capital reserves and long-term supplier relationships. Regulatory complexity is another obstacle, particularly for companies operating across multiple regions. Varying safety, environmental, and intellectual property laws add layers of compliance, potentially delaying product development cycles and increasing costs. Buy Now: Key Companies and Competitive Landscape The competitive landscape of the semiconductor market includes several global giants. Key players include: Intel Corporation: Actively investing in advanced nodes and AI hardware. Samsung Electronics: Known for technological breakthroughs in chip fabrication. TSMC: The global leader in semiconductor foundry services, especially at 3nm and 5nm nodes. NVIDIA Corporation: Dominating AI and GPU segments with continual innovation. Advanced Micro Devices (AMD): Gaining market share in CPUs and GPUs. Qualcomm: Expanding into automotive semiconductors and wireless technologies. Broadcom, Micron Technology, Texas Instruments, Analog Devices, ON Semiconductor, and Renesas also hold substantial positions across various product categories. Key Competitors Intel Corporation Samsung Electronics Taiwan Semiconductor Manufacturing Company (TSMC) NVIDIA Corporation Advanced Micro Devices (AMD) Qualcomm Incorporated Broadcom Inc. Texas Instruments Micron Technology Skyworks Solutions STMicroelectronics Infineon Technologies AG Analog Devices Inc. ON Semiconductor Renesas Electronics Corporation Recent Developments in the Market Company Name: TSMC Month & Year: October 2023 Type of Development: Expansion Detailed Analysis: In October 2023, TSMC announced a significant expansion of its manufacturing facilities in Taiwan and the United States, aimed at increasing production capacity for advanced semiconductor nodes, particularly in the 3nm and 5nm categories. This expansion is a strategic response to the surging demand for high-performance computing, artificial intelligence, and mobile applications. The significance lies in TSMC's position as a leading foundry supplier; this move may solidify its competitive edge, enabling it to meet clients' demands more effectively than rivals like Intel and Samsung. The expansion could also catalyze shifts in supply chain dynamics as companies increasingly rely on TSMC's advanced technology capabilities. Moreover, it could prompt other semiconductor manufacturers to accelerate their own capacity enhancements or technological upgrades to retain competitiveness in the saturated market, potentially leading to increased pressure on prices and margins. Company Name: NVIDIA Corporation Month & Year: September 2023 Type of Development: Product Launch Detailed Analysis: NVIDIA launched its new series of GPUs based on its latest architecture, featuring significant advancements in AI processing capabilities in September 2023. This product launch is pivotal as it not only targets gamers but also positions NVIDIA firmly at the forefront of AI and machine learning markets, further establishing its dominance over competitors such as AMD and Intel. The GPUs are designed to enhance performance in data centers and gaming environments, responding to the increasing demand for high-fidelity graphics and computational power. As artificial intelligence applications penetrate various sectors, this development is likely to boost NVIDIA's sales and reinforce its market position, potentially leading to greater investments in AI from the tech industry. The impact also extends to the competitive landscape, prompting rivals to innovate swiftly or risk obsolescence. Company Name: Qualcomm Incorporated Month & Year: August 2023 Type of Development: Partnership Detailed Analysis: In August 2023, Qualcomm announced a strategic partnership with a leading automobile manufacturer to develop advanced semiconductor solutions for electric vehicles (EVs). This alliance is significant as it marks Qualcomm's deeper entry into the automotive sector, particularly in the fast-growing EV market. By leveraging its strengths in wireless technology and AI, Qualcomm aims to provide cutting-edge technologies that enhance vehicle connectivity and autonomous driving capabilities. The potential shift in the market landscape could see Qualcomm evolving from a mobile-centric company to a key player in automotive semiconductors, increasing competition with established companies like Infineon and NXP Semiconductors. The partnership may also drive more OEMs to explore new collaborations, fostering industry-wide innovation in electric mobility. Company Name: Intel Corporation Month & Year: July 2023 Type of Development: Merger Detailed Analysis: Intel announced the merger with a prominent artificial intelligence startup in July 2023, enhancing its capabilities in AI hardware development. This merger is crucial as it aligns with Intel's strategic pivot towards AI and high-performance computing, sectors expected to flourish in the coming years. The integration of this startup's innovative technologies with Intel's established platforms is poised to accelerate the development of AI solutions, potentially reshaping industry standards. This move is likely to impact competition, with other industry players possibly feeling pressured to pursue similar acquisitions to stay relevant. Furthermore, the merger highlights the accelerating convergence of traditional semiconductor manufacturing and AI, indicating a broader industry trend toward integrated technology solutions. Company Name: Samsung Electronics Month & Year: June 2023 Type of Development: Technological Advancement Detailed Analysis: In June 2023, Samsung unveiled its latest semiconductor fabrication technology that promises to reduce power consumption by up to 30% while enhancing performance at the same time. This advancement is of great significance as energy efficiency becomes increasingly critical for both environmental and economic reasons, particularly in the face of global energy regulations. By rolling out this technology, Samsung is not only reinforcing its commitment to sustainability but also boosting its competitiveness against other semiconductor giants, especially TSMC and Intel, who face similar pressures. The adoption of this technology may drive a shift in market preferences as manufacturers prioritize energy-efficient solutions, potentially reshaping product offerings and competitive strategies across the semiconductor landscape. This report is also available in the following languages : Japanese (最先端半導体技術市場), Korean (최첨단 반도체 기술 시장), Chinese (尖端半导体技术市场), French (Marché des technologies de pointe des semi-conducteurs), German (Markt für Spitzentechnologie im Halbleiterbereich), and Italian (Mercato all'avanguardia della tecnologia dei semiconduttori), etc. Request Sample Pages: More Research Finding – Gan Power Devices Market The global GaN (Gallium Nitride) power devices market is projected to reach a value of approximately $3.7 billion in 2024. The market is poised for significant growth, with forecasts suggesting it could expand to around $12.1 billion by 2034, reflecting a compound annual growth rate (CAGR) of about 12.4% from 2025 to 2034. Chip Manufacturing Market The global chip manufacturing market is valued at approximately $500 billion in 2024. The market is projected to reach around $1 trillion by 2034, driven by the escalating demand for advanced semiconductors across various sectors, including automotive, consumer electronics, and artificial intelligence. This translates to a robust Compound Annual Growth Rate (CAGR) of 7% from 2025 to 2034. Japan Semiconductor Supply Chain Market The Japanese semiconductor market is valued at approximately $45 billion, bolstered by significant investments in technology and manufacturing infrastructure. The market is projected to grow, reaching around $70 billion by 2034, driven by rising demand for advanced electronics and increased adoption of AI, IoT, and automotive applications. This represents a robust Compound Annual Growth Rate (CAGR) of around 5.7% over the forecast period from 2025 to 2034. ASIC Semiconductor Market The global Application-Specific Integrated Circuit (ASIC) semiconductor market is valued at approximately $26 billion in 2024, propelled by the growing demand for customized computing solutions across sectors such as telecommunications, automotive, and artificial intelligence. The market is anticipated to reach around $52 billion by 2034, reflecting robust growth driven by the proliferation of advanced technologies in data processing and machine learning. Silicon Reclaim Wafers Future Trends and Market The silicon reclaim wafer market is valued at approximately $1.2 billion, with projections suggesting a substantial growth trajectory, driving the market value to around $3.4 billion by 2034. This translates to a Compound Annual Growth Rate (CAGR) of approximately 11% during the forecast period from 2025 to 2034. Laser Diodes Market The global laser diodes market is valued at approximately $12.5 billion, driven by increasing demand in various sectors, including telecommunications, consumer electronics, and medical applications. The market is expected to grow significantly, reaching an estimated $22 billion by 2034, reflecting a CAGR of about 6.3% from 2025 to 2034. Gan Semiconductor Devices Market The global gan semiconductor devices market is valued at approximately $3.6 billion in 2024, with sustained growth expected over the next decade. Projections suggest the market will reach around $10.2 billion by 2034, reflecting a robust Compound Annual Growth Rate (CAGR) of 10.6% during the forecast period (2025–2034). Semiconductor Fabrication Software Market The global semiconductor fabrication software market is valued at approximately $8.2 billion in 2024, with a projected growth to around $15.6 billion by 2034. This growth reflects a robust Compound Annual Growth Rate (CAGR) of about 7.0% during the forecast period of 2025 to 2034. Semiconductor Silicon Intellectual Property SIP Market The global Semiconductor Intellectual Property (SIP) market is valued at approximately $6.7 billion. The market is projected to reach around $11.5 billion by 2034, reflecting a robust growth trajectory driven by the increasing demand for advanced semiconductor solutions in sectors such as consumer electronics, automotive, and telecommunications. FinFET Technology Market The FinFET technology market is experiencing significant growth, with a current value of approximately $40 billion in 2024. This market is projected to reach around $75 billion by 2034, reflecting a robust Compound Annual Growth Rate (CAGR) of 6.5% during the forecast period from 2025 to 2034. Semiconductor Fabrication Materials Market The semiconductor fabrication materials market is poised for significant growth, with a current market value estimated at approximately $65 billion in 2024. Projections indicate a market expansion to around $120 billion by 2034. Semiconductor Assembly and Testing Services SATS Market The Semiconductor Assembly and Testing Services (SATS) market is valued at approximately $19 billion in 2024, reflecting a robust demand driven by technological advancements and the growing complexity of semiconductor devices. During the forecast period from 2025 to 2034, the market is projected to reach around $30 billion, supported by an anticipated Compound Annual Growth Rate (CAGR) of 5.4%. Semiconductor Advanced Packaging Market The global semiconductor advanced packaging market is poised to reach approximately $50 billion in 2024, driven by rapid advancements in chip design and increasing demand for miniaturization in electronics. The market is projected to grow at a compound annual growth rate (CAGR) of 7.5% from 2025 to 2034, potentially exceeding $100 billion by the end of the forecast period. Test Burn-in Sockets market The global market for test and burn-in sockets is valued at approximately $3.2 billion in 2024 and is anticipated to reach around $5 billion by 2034. This represents a Compound Annual Growth Rate (CAGR) of about 4.5% over the forecast period. Semiconductor Laser Therapy Device Market The global market for Semiconductor Laser Therapy Devices is valued at approximately $1.2 billion in 2024, with projections indicating growth to around $2.8 billion by 2034. This growth underscores a robust compound annual growth rate (CAGR) of about 8.7% from 2025 to 2034, driven by the increasing adoption of laser therapies in various medical fields, including dermatology, ophthalmology, and pain management. Test Handler Market The global test handler market is valued at approximately $1.8 billion in 2024, with projections estimating it will reach around $3.3 billion by 2034, driven by increased demand for semiconductor testing in various applications, including automotive and consumer electronics. The market is expected to grow with a Compound Annual Growth Rate (CAGR) of about 6.6% over the forecast period from 2025 to 2034. Semiconductor Gas Abatement Systems Market The global semiconductor gas abatement systems market is valued at approximately $3.1 billion, driven by increasing demand for eco-friendly manufacturing processes in the semiconductor industry. The market is projected to reach about $5.8 billion by 2034, indicating a robust Compound Annual Growth Rate (CAGR) of around 6.6% over the forecast period from 2025 to 2034. Semiconductor Diaphragm Valve Market The global semiconductor diaphragm valve market is valued at approximately $1.2 billion in 2024, with projections indicating a growth trajectory towards $2.1 billion by 2034. This reflects a robust Compound Annual Growth Rate (CAGR) of about 6.3% over the 2025-2034 forecast period. CONTACT: Irfan Tamboli (Head of Sales) Phone: + 1704 266 3234 Email: sales@ in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
United News of India
06-06-2025
- Automotive
- United News of India
RIR Power Electronics expands SiC diode production
New Delhi, June 5 (UNI) In a significant step towards bolstering India's indigenous semiconductor capabilities, RIR Power Electronics Ltd. on Thursday announced the successful expansion of its 1200V Silicon Carbide (SiC) diode production through a strategic collaboration with Taiwan-based Pro Asia Semiconductor Corporation (PASC). The partnership is expected to fast-track RIR's go-to-market strategy by enabling the rollout of SiC devices in various voltage and current ratings, thereby de-risking operations and accelerating the ramp-up of high-efficiency power solutions from RIR's upcoming fabrication facility in Odisha. As part of the initiative, 1200V Schottky Barrier Diodes (SBDs) ranging from 2A to 60A—covering the most widely used configurations across multiple applications—have already been manufactured at PASC's state-of-the-art fab in Taiwan and shipped to India. The company has secured purchase orders from Richardson Electronics (USA) and Ankit Plastics (India), both major players in the commercial, industrial, and defence supply chains. "This milestone strengthens RIR's position as a serious player in the global power semiconductor space," said Dr. Harshad Mehta, Chairman and Director of RIR Power Electronics Ltd. "It also lays the foundation for full-fledged production from our planned Odisha SiC fab, which will serve high-growth markets such as automotive, renewable energy, industrial, and defence." The production expansion is backed by a comprehensive technology transfer agreement signed on October 17, 2024, with Sicamore Semi, USA. Under the agreement, RIR holds exclusive manufacturing and commercialisation rights for SiC diodes, MOSFETs, and IGBTs based on Sicamore's proven IP. The technology, originally developed for 4-inch wafers, has been successfully scaled up to 6-inch production with support from Vortex Semi (USA) and PASC. RIR's Odisha facility, with a proposed investment of Rs 618 crore, forms a crucial part of India's 'Make in India' semiconductor drive. It is expected to reduce the country's import dependency in strategic sectors, create employment, and position India as a competitive player in global advanced electronics manufacturing. UNI BDN RN
Business Upturn
05-06-2025
- Automotive
- Business Upturn
RIR Power Electronics expands SiC diode production in partnership with Taiwan's Pro Asia Semiconductor
RIR Power Electronics Limited has announced a significant manufacturing milestone with the expansion of its 1200V Silicon Carbide (SiC) diode production in collaboration with Pro Asia Semiconductor Corporation (PASC), Taiwan. This move supports RIR's aggressive go-to-market strategy for high-efficiency power solutions and aligns with India's 'Make in India' semiconductor ambitions. The new product line includes 1200V Schottky Barrier Diodes (SBDs) ranging from 2 amps to 60 amps. These diodes have been manufactured at PASC's facility and successfully shipped to India. RIR has already secured purchase orders from Richardson Electronics (USA) and Ankit Plastics (India), underlining global demand for SiC devices in commercial, industrial, and defence applications. This manufacturing initiative leverages the SiC technology acquired by RIR Power from Sicamore Semi (USA) in October 2024. Originally designed for 4-inch wafers, the technology has been scaled to 6-inch wafers with support from Vortex Semi (USA) and PASC, Taiwan. Dr. Harshad Mehta, Chairman & Director of RIR Power, said, 'This achievement strengthens RIR's capability to serve global high-growth sectors including automotive, industrial, renewable energy, and defence.' The company also plans to commence production from its upcoming ₹618 crore SiC semiconductor facility in Odisha. The strategic expansion is expected to generate employment and enhance India's self-reliance in critical electronics manufacturing.
Time of India
14-05-2025
- Automotive
- Time of India
Electric drive motors - From concept to series production
The electrification of passenger cars represents a diverse market segment spanning from compact city cars to high-performance luxury and sports vehicles. In addition to conventional performance features, the vehicle's electrical system voltage plays a crucial role, determined by requirements for charging times and system efficiency among others. In the automotive industry, two main voltage classes have been established: around 400 V in conjunction with Silicon Insulated Gate Bipolar Transistors (Si-IGBTs) and approximately 800 V in conjunction with Silicon Carbide (SiC) transistors. In compact cars, mainly 400 V systems are utilized, while in higher vehicle classes, depending on market positioning, both technologies may be 1 depicts market data of systems for peak power in relation to torque. BorgWarner's Integrated Drive Modules (iDMs) are designed to be utilized in vehicles across various segments from A to D as well as in voltage classes of 400 and 800 V. The basic modular solutions are adjusted according to market requirements, such as when the customer requires more power or torque. To meet the requirements of each drive system, component platforms are defined for all core components of the drive modules, especially gearbox, electric motor, and inverter, and are implemented based on BorgWarner's internal development competencies. For instance, the inverters are based on patented power module technology called Viper. Mechanical components in focus: Structure and function of the drive system The mechanical configuration of the drives in current series productions of iDMs encompasses both drive architectures with parallel countershaft and coaxial gearboxes. In most cases, the arrangement with parallel countershaft is preferred due to cost advantages and efficiency. However, for limited installation spaces, a concentric countershaft or coaxial arrangement of the gearbox offers advantages. The range of drive modules extends from the iDM146, used in compact cars, to the iDM180 for the mid-range, up to the iDM220, covering systems from 170 to over 350 kW, thus encompassing a broad spectrum. All systems can be configured either as Permanent Magnet Synchronous Motors (PMSM) or as Induction Motors (IM) with a unified stator. Additionally, an option with Externally Excited Synchronous Machine (EESM) is offered for the iDM220 module. Starting from iDM180, the stator and rotor of all systems are oil-cooled. A regulated oil cooling for stator and rotor through an electric oil pump meets the demand for higher continuous power. Figure 2 shows the iDM220 module and its components. The oil-cooled system features a heat exchanger and an electric oil pump, enabling on-demand cooling and lubrication, thus increasing efficiency. Furthermore, a variant with an integrated park lock is offered. The Viper power module technology with double-sided cooling enables high power density. Drive systems with EESM offer the possibility to control the excitation field and are therefore a good choice for secondary drives. However, the packaging challenges for secondary drives are higher. The best solution in terms of packaging is a coaxial arrangement. The requirements of such a system are met with brushless transformer technology. The brushless transformer solution for EESM consists of a single robust printed circuit board transformer with a highly efficient resonant inductive excitation system, thus enabling a compact design. This solution is suitable for all mechanical configurations, including a coaxial arrangement. Integrating this system into the oil-cooled motor area required a simple design of rotation transformer and rectifier. Figure 3 shows the concept of a brushless system designed for voltages of 800 V, requiring 15per cent less space compared to brush-bearing systems. Next-gen integrated drive module: Concept and development The next-generation drive module responds to market demands for ultra-compact systems aimed at reducing costs and offering higher efficiency than traditional systems [4], see Figure 4. The fully integrated high-speed drive module is equipped with a high-speed differential gearbox at the rotor shaft of the electric motor, as well as two gearboxes for low torques. By integrating a differential unit with lower torque capacity, the required space compared to similar concepts has been significantly reduced. Due to system requirements, the electric motor has been completely redesigned compared to currently produced motors. Taking these requirements into account, new rotor properties have been developed, allowing speeds of over 20,000 rpm. Despite further reduction in rotor losses, such a concept requires additional optimization of motor cooling. The solution involves complete immersion cooling of the stator winding heads in circulating oil flow. E-Motors: high-voltage hairpin technology Hairpin technology for electric motors has achieved a power density and maximum efficiency of over 97per cent with the latest Hairpin Stator Winding Technology (HVH) for the high-voltage range, see Figure 5. The motors in the HVH series are available in multiple versions with various configurations of different lengths, cooling methods, and winding options, either as a complete motor with housing or as a rotor-stator unit. The product portfolio starts with an outer diameter of 146 mm (HVH146) and a peak power of 90 kW. The medium-size and power range are covered by several variants of the HVH180 with peak powers up to 190 kW. For applications requiring higher power, BorgWarner offers several versions of the HVH220 with a peak power of 350 kW. At the top end of the product range for passenger car applications is the high-performance version with an outer diameter of 264 mm (HVH264) and a peak power of 450 kW. Especially in the high-power versions, regulated oil cooling is used for the rotor, where the cooling medium is brought close to the permanent magnets. This proximity to the magnets is crucial for continuous power and also allows the use of magnets with lower rare earth element requirements. The HVH320 is a novel development for applications requiring high torque at low speeds. This new HVH320 platform, launching in 2024, will be produced in three versions with maximum power/maximum torque of 1280 Nm/485 kW, 1500 Nm/525 kW, and 1650 Nm/575 kW. The motor features innovative wire insulation (single-layer polyetheretherketone) meeting the highest quality standards, as well as immersion cooling of the winding heads to deliver the highest possible continuous torque. Fully bonded laminated core packages in the stator and rotor ensure high efficiency. The end winding and stator are designed to provide sealing against a thermal protection cover that directs oil flow. In motors with interior permanent magnets (IPM), neodymium permanent magnets are used in the current large series with a low proportion of heavy rare earth elements dysprosium or terbium. The next development focuses on a concept that aims for sustainability without heavy rare earth elements. Since heavy rare earth elements protect against demagnetization under extreme operating conditions, new magnet techniques, further improvements in stator and rotor cooling, and optimization of motor control, which can limit the current peaks when switching to active short circuit (AKS), are combined in a holistic approach. S-winding technology The advancement of S-winding technology for use in electric motors is depicted in Figure 6. The second generation (S-Wind Gen2) is widely employed in P2 drive modules for hybrid vehicles in the EU and Chinese markets, with an outer diameter of 270 mm (SW270). The latest generation (S-Wind Gen3) is utilized in 48-V P3 modules with an outer diameter of 130 mm (SW130) for drive motors. Compared to hairpin technology, S-winding offers clear packaging advantages due to the length of the winding head, eliminating the need to weld individual pins. This is particularly crucial for P2 module applications. The S-winding technology is based on a stator geometry with open stator slots. A special winding process enables the extension of the formed continuous wire initially wound onto a mandrel into the stator. According to measurements conducted in accordance with the Worldwide Harmonized Light-Duty Vehicles Test Procedure (WLTP), the efficiencies of both concepts differ by 0.8per cent when using a comparable number of slots and conductors per slot. With the further development of S-winding technology, variants with a higher number of conductors per stator slot and a higher number of stator slots are being developed. This enables consistently high rotational speeds, and with an identical stator diameter, the same efficiency as hairpin technology is achieved according to WLTP. This approach allows for better efficiency than hairpin technology at high torque and high rotational speeds (typical during highway driving) due to significantly lower alternating current copper losses with slightly higher direct current copper losses due to the smaller wire cross-section in conjunction with the large number of wires per slot. The market demand for various concepts is currently highly heterogeneous and is expected to continue in this diversity over the coming decade. Hairpin technology is projected to continue dominating as it offers the highest efficiency according to WLTP. S-winding technology, with a high number of slots and conductors per slot, ensures excellent performance and efficiency at high speeds, leading to its establishment in the market. Advancements in the sustainability of IPM technology will be a central focus of development in the coming years.
Associated Press
21-03-2025
- Business
- Associated Press
Sungrow Outlines 10 Must-Know Technological Trends Driving Solar and Storage Development
MUNICH, March 20, 2025 /PRNewswire/ -- Recently, Dr. David Zhao, Senior Vice President of Sungrow, presented in his latest speech the 10 major technological trends in the solar and storage industry, which will drive the energy transition and ensure sustainable economic development. Dr. Zhao noted that despite the rapid expansion of PV installations worldwide, the evolving power infrastructure faces five challenges: supply chain security, clean energy consumption, power system stability, resilience to load variability, and cost management. As a vital part of power decarbonization, the energy storage sector is going through a period of intense accelerated growth. Drawing on his deep understanding of the industry, Dr. Zhao identified ten crucial technological trends essential for advancing solar and storage development. 1. High Density and High Efficiency With the declining costs and increased localization of third-generation wide-bandgap semiconductors, inverters are progressively incorporating Silicon Carbide (SiC) and Gallium Nitride (GaN) devices. Enhanced by advanced control algorithms, increased computing power, and novel thermal packaging technologies, these changes will significantly boost the power density and efficiency of equipment. Sungrow was at the forefront of commercializing SiC devices in PV inverters. In 2021, the company introduced the 1500V string inverter SG350HX, marking a pioneering move with the adoption of 2000V SiC devices. 2. Development of High-Voltage and High-Power Systems Over the past decade, inverter single-unit power has undergone a major improvement cycle every 2-3 years, with DC voltage moving toward 2000V. Sungrow deployed the world's first 2000V DC PV system in China's Shaanxi province, reducing Balance of System (BOS) costs by over 0.04 yuan (USD cent 0.55) per watt compared to 1500V systems, setting a new industry benchmark for cost reduction and efficiency improvement. 3. Grid Forming As renewable energy penetration increases, grid-forming technologies are becoming essential to ensure a flexible, reliable, and resilient power system. Since 2006, Sungrow has been at the forefront of grid-forming technology research, honing core capabilities such as flexible inertia support, wide-frequency oscillation suppression, enhanced continuous high/low voltage ride-through, microsecond-level voltage construction, adaptive harmonic management, rapid off-grid debugging, seamless switch between on-grid and off-grid modes, and gigawatt-scale project black-start technology. Sungrow has abundant global grid-forming practices, providing customized solutions tailored to diverse grid conditions, ensuring grid safety and stability worldwide. 4. Digitalization and AI Empowerment Digitalization and AI are revolutionizing the entire lifecycle of PV plants, boosting both reliability and operational efficiency. Sungrow has utilized advanced AI training techniques for inverters to create a sophisticated AI-driven battery management system. This system constantly tracks and analyzes multiple parameters of battery cell states, such as temperature, current, voltage, and pressure. By doing so, it enables real-time health assessments, offers early alerts for cells showing signs of potential issues, and prevents the onset of thermal runaway, significantly improving the safety and performance of PV installations. 5. Secure and Reliable Systems Dr. Zhao noted that a 30-year system design lifespan is set to become a new trend and standard for future inverters. He outlined more than a dozen advanced designs and technologies integral to system security and reliability, including modular design, multi-tier active fault alarms, arc detection, and shutdown mechanisms. In addition, Sungrow invested in two large-scale, real-world energy storage system burn tests, each costing over 10 million yuan (approx. USD 1.4 million), to affirm the safety of its liquid-cooled energy storage system PowerTitan series. These tests safeguard personnel, assets, and operational safety, setting a new safety benchmark for the energy storage industry. 6. Topology Innovation Topology innovation plays a crucial role in enhancing power conversion efficiency. In 2018, Sungrow spearheaded a major R&D project and developed the world's first 6MW 35kV Solid State Transformer based (SST-based) PV inverter. This inverter replaced traditional low-frequency transformer with a high-frequency one, achieving an overall maximum efficiency of 98.5%. This is just one instance of how innovative topologies are continually evolving and being applied across various solar and storage applications. 7. High-Precision Simulation For different global scenarios and grid conditions, system-level modeling and simulation capabilities are needed to mimic the performance of solar, wind, and storage systems in on-grid/off-grid and steady-state/transient processes. As simulation systems evolve, they will increasingly approximate real-world conditions, significantly shortening inverter and power system development cycles while reducing costs. 8. Virtual Power Plants Virtual power plants (VPPs) leverage internet technologies to aggregate distributed PV, energy storage, and loads into a unified entity for grid dispatch. VPPs optimize energy utilization, promote clean energy consumption, reduce grid congestion and negative pricing, and enable control in patches for grid ancillary services, ensuring rapid response and grid stability. This significantly reduces grid construction and operational costs. By leveraging real-time monitoring and demand forecasting, VPPs can guide users to optimize their electricity consumption, and, by doing so, enhance supply reliability. 9. Source-Grid-Load-Storage-Carbon Integration Dr. Zhao proposed, for the first time in the industry, that integrated management of source-grid-load-storage-carbon systems can promote large-scale clean energy integration, reduce curtailment, and achieve clear carbon reduction goals. He cited as an illustration how Sungrow is providing integrated solutions for the world's largest 2.2GW wind-PV-storage-hydrogen multi-energy complementary microgrid project in Saudi Arabia. He further commented that 2025 will mark the beginning of zero-carbon parks, with source-grid-load-storage-carbon integration becoming the preferred solution. 10. Green Hydrogen, Ammonia, and Methanol The global demand for green hydrogen is soaring, and renewable energy-based electrolysis represents a critical future pathway. Moreover, ammonia and methanol are becoming increasingly popular due to their ease of storage and transport. Decoupling power generation from hydrogen production systems allows for the remote production of hydrogen through power transmission. Hydrogen production rectifiers, designed with fast dynamic response capabilities, are adept at managing the power fluctuations inherent in renewable energy sources. These features make them well-suited for use in large-scale renewable hydrogen production facilities and central hydrogen production stations. 'Sungrow embeds technological innovation in our DNA. We commit to tackle the difficulties and pursue a long-term sustainable future with industry partners and peers,' concluded Dr. Zhao. About Sungrow Sungrow, a global leader in renewable energy technology, has pioneered sustainable power solutions for over 28 years. As of December 2024, Sungrow has installed 740 GW of power electronic converters worldwide. The Company is recognized as the world's No. 1 on PV inverter shipments (S&P Global Commodity Insights) and the world's most bankable energy storage company (BloombergNEF). Its innovations power clean energy projects in over 180 countries, supported by a network of 520 service outlets guaranteeing excellent customer experience. At Sungrow, we're committed to bridging to a sustainable future through cutting-edge technology and unparalleled service. For more information, please visit:
