Latest news with #UALink
Yahoo
24-06-2025
- Business
- Yahoo
Marvell Unveils UALink to Boost AI Accelerator Connectivity for 5G Growth
Marvell Technology, Inc. (NASDAQ:MRVL) is on our list of the 10 best 5G stocks to invest in according to analysts. On June 11, Marvell Technology, Inc. (NASDAQ:MRVL) unveiled its unique Ultra Accelerator Link (UALink) scale-up solution, which is intended to improve the interconnectivity of AI accelerators and switches. The company claims that in a single deployment, the customized UALink solution allows scale-up interconnects for hundreds or thousands of AI accelerators. The announcement comes as growing AI infrastructure while preserving performance becomes a bigger challenge for hyperscalers. Marvell claims that by using an open-standards-based approach that permits direct, low-latency communication between accelerators, its proprietary UALink product solves these issues. Forrest Norrod, an AMD executive, also endorsed the development, stating: 'We are excited to see UALink custom solutions from Marvell, which are essential to the future of AI.' Marvell Technology, Inc. (NASDAQ:MRVL) has made a name for itself as a leader in the creation of data processing units (DPUs). In 2021, Marvell Technology, Inc. (NASDAQ:MRVL) made major acquisitions, including Inphi and Innovium, in an attempt to increase its global footprint in important industries including 5G, cloud computing, and other business solutions. While we acknowledge the potential of MRVL as an investment, we believe certain AI stocks offer greater upside potential and carry less downside risk. If you're looking for an extremely undervalued AI stock that also stands to benefit significantly from Trump-era tariffs and the onshoring trend, see our free report on the best short-term AI stock. Read More: and Disclosure: None. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
23-06-2025
- Business
- Yahoo
Astera Labs' AI Infrastructure Demand Accelerates: More Upside Ahead?
Astera Labs ALAB has positioned itself in the field of next-generation AI and cloud infrastructure with a robust start to 2025. The company recently outlined a compelling roadmap powered by technological leadership across interconnect standards, a factor that now stands as its core growth engine. Let us delve deeper. Astera Labs has built a first-mover advantage with a full stack of PCIe Gen 6 solutions, including retimers, smart gearboxes, optical modules and fabric switches, designed to meet the stringent performance and signal integrity demands of modern AI racks. At the same time, its Leo CXL product family addresses the growing need for memory expansion and pooling as data center CPUs adopt CXL 2.0 and 3.0, enabling support for both AI and general-purpose compute workloads. Looking ahead, Astera Labs is poised to further expand its market through emerging standards like UALink and NVLink Fusion. With UALink 1.0 introduced in early 2025, Astera Labs plans to commercialize solutions by 2026, opening the door to a scalable, open interconnect for AI accelerators and unlocking a multibillion-dollar opportunity. In parallel, the company's deepening collaboration with NVIDIA NVDA integrates NVLink Fusion into its Intelligent Connectivity Platform, delivering low-latency, memory-coherent links for GPU clustering, essential for powering the next generation of LLMs and agentic AI models. Marvell Technology- Diversified Scale Meets AI Connectivity: Marvell Technology MRVL is a notable peer in data center interconnects, with strengths in custom ASICs, PAM4 DSPs and 800G optical solutions. While its broader focus spans 5G and enterprise storage, Marvell increasingly competes with Astera Labs in cloud-optimized Ethernet and silicon platforms. However, Astera Labs' tighter integration of hardware and software via the COSMOS suite gives it a unique edge in AI-specific system observability and fleet management, areas where Marvell remains less specialized. Broadcom-Scale Leader With Limited AI Rack Focus: Broadcom AVGO holds strong positions in PCIe switches, SerDes and networking silicon, serving all major hyperscalers. Yet, its offerings are typically component-level and less tailored for AI rack-scale deployments. Unlike Broadcom's broad-market strategy, Astera Labs focuses on delivering interoperable subsystems purpose-built for AI, giving it greater agility in addressing emerging infrastructure needs like UALink, CXL and NVLink-based clustering. Astera Labs has risen 26.2% in the past three months compared with the industry and the sector's 10.2% and 7.5% growth, respectively. The S&P 500 index has improved 3.6% during the said period. Image Source: Zacks Investment Research Astera Labs is presently trading at a forward 12-month price-to-sales of 19.19X, which is below its 1-year median of 19.86X. However, it remains overvalued compared with the industry. Image Source: Zacks Investment Research ALAB currently carries a Zacks Rank #2 (Buy). You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report NVIDIA Corporation (NVDA) : Free Stock Analysis Report Marvell Technology, Inc. (MRVL) : Free Stock Analysis Report Broadcom Inc. (AVGO) : Free Stock Analysis Report Astera Labs, Inc. (ALAB) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research
Yahoo
20-06-2025
- Business
- Yahoo
Marvell's AI Bet: Will NVLink and UALink Drive Custom Chip Wins?
Marvell Technology MRVL is enhancing its role in artificial intelligence (AI) infrastructure by expanding its custom chip capabilities. Marvell continues to integrate its custom compute platform with new components that improve performance, scalability, and integration across large-scale the first quarter of fiscal 2026, Marvell reported record Data Center revenues of $1.44 billion, up 76% year over year. The growth was driven by the rapid scaling of custom AI silicon. To support continued momentum, Marvell recently announced multiple strategic additions to its custom silicon May 2025, Marvell partnered with NVIDIA to offer NVIDIA's NVLink Fusion technology to customers deploying Marvell's custom cloud platform silicon. This enables custom XPUs to connect with NVIDIA's rack-scale hardware architecture. Marvell noted that its custom silicon with NVIDIA NVLink Fusion offers its customers greater flexibility and options in developing next-generation AI infrastructure. This announcement reflects that MRVL's custom chips are gaining credibility and traction, even among companies like the same month, Marvell introduced its new multi-die packaging solution, which is built on its proprietary interposer technology. The solution is already in production for a customer-specific XPU program. The platform enables more efficient die-to-die interconnect, lowers power consumption, enhances yield and lowers product this month, Marvell introduced a third addition to its custom platform — Ultra Accelerator Link (UALink) scale-up solution. The solution delivers an open-standards-based scale-up interconnect platform with high compute utilization and low latency. UALink is paired with Marvell custom silicon capabilities. This allows compute vendors to build solutions, including custom accelerators with UALink controllers and custom switches, enabling optimal performance for rack-scale these additions support Marvell's push to enable full rack-level custom infrastructure. Moreover, with new components entering production, Marvell is positioned to play a crucial role in powering the next generation of large-scale AI systems. Advanced Micro Devices AMD is advancing its rack-level AI solutions through its acquisition of ZT Systems. This acquisition enables Advanced Micro Devices to reduce deployment time for hyperscalers by combining AMD's CPUs, GPUs, and networking components. This move also enables Advanced Micro Devices to accelerate time to market for its OEM and ODM AVGO is aggressively scaling its AI networking portfolio. In the second quarter of fiscal 2025, AVGO's AI networking revenues jumped 170% year over year and now comprise 40% of its total AI semiconductor revenues. Broadcom also introduced the Tomahawk 6 switch with a 102.4 Terabits per second switch capacity. It is designed to enable AI clusters of over 100,000 AI accelerators to be deployed in 2 tiers. This move enables Broadcom to achieve better performance in training its next-generation frontier models through lower latency, higher bandwidth and lower power. Shares of Marvell Technology have plunged 31.9% year to date against the Electronics - Semiconductors industry's growth of 6.4%. Image Source: Zacks Investment Research From a valuation standpoint, Marvell Technology trades at a forward price-to-sales ratio of 7.36X, lower than the industry's average of 8.15X. Image Source: Zacks Investment Research The Zacks Consensus Estimate for MRVL's fiscal 2026 and fiscal 2027 earnings implies year-over-year growth of 77.71% and 27.73%, respectively. The earnings estimates for fiscal 2026 and fiscal 2027 have been revised upward in the past 30 days and seven days, respectively. Image Source: Zacks Investment Research MRVL currently carries a Zacks Rank #3 (Hold). You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Advanced Micro Devices, Inc. (AMD) : Free Stock Analysis Report Marvell Technology, Inc. (MRVL) : Free Stock Analysis Report Broadcom Inc. (AVGO) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research Sign in to access your portfolio
Yahoo
18-06-2025
- Business
- Yahoo
Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
Modular, software-defined system IP is driving the next generation of AI innovation SAN JOSE, Calif., June 18, 2025--(BUSINESS WIRE)--Baya Systems, a leader in high-performance semiconductor system technologies, today celebrated its return to the Design Automation Conference (DAC) and the anniversary of its emerging from stealth. In this transformative year, Baya has achieved strong customer traction, significant team growth and key technology breakthroughs– solidifying its role in enabling the next-generation of AI compute innovations, through modular, scalable, high-performance and future-proofed solutions that address market challenges. A Year of Breakthrough Growth Since debuting in June 2024 with Tenstorrent as its first customer, Baya has achieved a 5x growth in design wins. This reflects the surging demand for Baya's modular, chiplet-ready system IP from companies developing bleeding-edge SoCs and chiplet solutions to drive AI acceleration across multiple verticals. Baya now has design engagements across North America, Europe and Asia. "AI needs a full-stack approach—from services to silicon. Systematic data movement and seamless orchestration across compute elements is essential. Efficient, scalable, intelligent fabric is critical—this is where Baya excels," said Jim Keller, CEO at Tenstorrent. Baya has secured a lead customer for its NeuraScale™ smart switching fabric announced in March 2025. This customer is leveraging NeuraScale to develop next-generation scale-up and scale-out networking solutions aligned with emerging UALink and Ultra Ethernet standards – aiming to support the AI industry's growing demand for dramatically higher node density with ultra-low-latency and all-to-all connectivity. "Baya's NeuraScale and WeaveIP™ fabrics enable us to architect differentiated, chiplet-based solutions that meet the performance and efficiency needs of tomorrow's AI data centers," said a spokesperson for the company. "These technologies are critical ingredients of our innovation stack, and we're excited about what we can achieve together." In January 2025, Baya secured a $36.5 million Series B round led by Maverick Silicon with strategic investment from Synopsys Inc. and continued backing from Matrix Partners and Intel Capital. This infusion of capital has accelerated the team's expansion, attracting additional top-tier talent from industry leaders like Apple, AMD, Arm, Intel and other major industry players. The company is accelerating product roadmaps, expanding commercial operations globally, and laying the foundation for explosive growth through the rest of 2025 and into 2026. Accelerating AI and Intelligent Compute As AI reshapes computing, the shift to advanced SoCs and chiplets is creating new design challenges. Baya's modular, correct-by-construction, and data-driven software platform is designed to reduce complexity and risk. Its WeaverPro™ platform enables rapid architectural analysis, configuration, and physically aware implementation, tightly integrated with WeaveIP™ system IP. This allows customers to efficiently design complex SoCs and chiplets from concept to production—accelerating time to market while improving performance and yield. Baya's WeaveIP portfolio, built on a unified transport layer, delivers scalable fabric solutions across diverse protocols. Its latest addition, NeuraScale, addresses data movement bottlenecks in AI training and inference with smart switching designed for scale and efficiency. A Strategic Role in the Semiconductor Ecosystem Baya's partner ecosystem is central to its momentum in enabling software-defined, chiplet-ready, unified fabric solutions. The company is driving cross-industry collaboration with different facets of the industry including RISC-V leaders like Tenstorrent, Semidynamics, and Andes Technology; dataflow compute partners like Imagination Technologies; and PHY/IP providers like Blue Cheetah and Synopsys. Baya is also working closely with Arm's AMBA ecosystem. "The semiconductor industry is shifting from transistor-centric design to software-driven, systems-oriented thinking and we're excited that Baya's momentum validates this mindset shift," said Dr. Sailesh Kumar, CEO of Baya Systems. "The intricate semiconductor ecosystem is also evolving, and we're collaborating with industry leaders to ensure our fabric and platform technology integrates seamlessly and scales efficiently. These collaborations are critical in accelerating the innovation." Baya will showcase its latest innovations at DAC 2025 (Booth #2430), and company leaders will share insights on scaling AI infrastructure and delivering high performance through programmable system IP at the EE Times Chiplet Summit (Booth #2308). To learn more, visit About Baya Systems Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird's nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. Baya is backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit or follow us on LinkedIn. View source version on Contacts Crackle PR for Baya Systemsbayasystems@ Error while retrieving data Sign in to access your portfolio Error while retrieving data Error while retrieving data Error while retrieving data Error while retrieving data
Business Wire
18-06-2025
- Business
- Business Wire
Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
SAN JOSE, Calif.--(BUSINESS WIRE)-- Baya Systems, a leader in high-performance semiconductor system technologies, today celebrated its return to the Design Automation Conference (DAC) and the anniversary of its emerging from stealth. In this transformative year, Baya has achieved strong customer traction, significant team growth and key technology breakthroughs– solidifying its role in enabling the next-generation of AI compute innovations, through modular, scalable, high-performance and future-proofed solutions that address market challenges. "AI needs a full-stack approach—from services to silicon. Systematic data movement and seamless orchestration across compute elements is essential. Efficient, scalable, intelligent fabric is critical—this is where Baya excels." A Year of Breakthrough Growth Since debuting in June 2024 with Tenstorrent as its first customer, Baya has achieved a 5x growth in design wins. This reflects the surging demand for Baya's modular, chiplet-ready system IP from companies developing bleeding-edge SoCs and chiplet solutions to drive AI acceleration across multiple verticals. Baya now has design engagements across North America, Europe and Asia. 'AI needs a full-stack approach—from services to silicon. Systematic data movement and seamless orchestration across compute elements is essential. Efficient, scalable, intelligent fabric is critical—this is where Baya excels,' said Jim Keller, CEO at Tenstorrent. Baya has secured a lead customer for its NeuraScale™ smart switching fabric announced in March 2025. This customer is leveraging NeuraScale to develop next-generation scale-up and scale-out networking solutions aligned with emerging UALink and Ultra Ethernet standards – aiming to support the AI industry's growing demand for dramatically higher node density with ultra-low-latency and all-to-all connectivity. "Baya's NeuraScale and WeaveIP™ fabrics enable us to architect differentiated, chiplet-based solutions that meet the performance and efficiency needs of tomorrow's AI data centers," said a spokesperson for the company. "These technologies are critical ingredients of our innovation stack, and we're excited about what we can achieve together." In January 2025, Baya secured a $36.5 million Series B round led by Maverick Silicon with strategic investment from Synopsys Inc. and continued backing from Matrix Partners and Intel Capital. This infusion of capital has accelerated the team's expansion, attracting additional top-tier talent from industry leaders like Apple, AMD, Arm, Intel and other major industry players. The company is accelerating product roadmaps, expanding commercial operations globally, and laying the foundation for explosive growth through the rest of 2025 and into 2026. Accelerating AI and Intelligent Compute As AI reshapes computing, the shift to advanced SoCs and chiplets is creating new design challenges. Baya's modular, correct-by-construction, and data-driven software platform is designed to reduce complexity and risk. Its WeaverPro™ platform enables rapid architectural analysis, configuration, and physically aware implementation, tightly integrated with WeaveIP™ system IP. This allows customers to efficiently design complex SoCs and chiplets from concept to production—accelerating time to market while improving performance and yield. Baya's WeaveIP portfolio, built on a unified transport layer, delivers scalable fabric solutions across diverse protocols. Its latest addition, NeuraScale, addresses data movement bottlenecks in AI training and inference with smart switching designed for scale and efficiency. A Strategic Role in the Semiconductor Ecosystem Baya's partner ecosystem is central to its momentum in enabling software-defined, chiplet-ready, unified fabric solutions. The company is driving cross-industry collaboration with different facets of the industry including RISC-V leaders like Tenstorrent, Semidynamics, and Andes Technology; dataflow compute partners like Imagination Technologies; and PHY/IP providers like Blue Cheetah and Synopsys. Baya is also working closely with Arm's AMBA ecosystem. 'The semiconductor industry is shifting from transistor-centric design to software-driven, systems-oriented thinking and we're excited that Baya's momentum validates this mindset shift,' said Dr. Sailesh Kumar, CEO of Baya Systems. 'The intricate semiconductor ecosystem is also evolving, and we're collaborating with industry leaders to ensure our fabric and platform technology integrates seamlessly and scales efficiently. These collaborations are critical in accelerating the innovation.' Baya will showcase its latest innovations at DAC 2025 (Booth #2430), and company leaders will share insights on scaling AI infrastructure and delivering high performance through programmable system IP at the EE Times Chiplet Summit (Booth #2308). To learn more, visit About Baya Systems Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird's nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. Baya is backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit or follow us on LinkedIn.
