Latest news with #WillChu
Yahoo
25-06-2025
- Business
- Yahoo
Ferric and Marvell Collaborate to Advance Integrated Voltage Regulation for AI and Cloud Infrastructure
Ferric's ultra-compact IVRs for Marvell integrated power solutions to boost performance, efficiency and ROI of accelerated infrastructure NEW YORK, June 25, 2025--(BUSINESS WIRE)--Ferric, Inc., a leader in cutting-edge power conversion solutions, announced its collaboration with Marvell Technology, Inc. (NASDAQ: MRVL) to develop optimized integrated power solutions for Marvell® custom silicon platforms, designed to improve performance, efficiency and return on investment (ROI) for AI and cloud infrastructure. Ferric's proprietary thin-film magnetic technology enables the world's highest density DC-DC power converters and marks a breakthrough in integrated power management. By miniaturizing power regulation at the silicon level, Ferric Integrated Voltage Regulators (IVRs) are more than 10x smaller than conventional solutions— making them uniquely suited for in-package integration in advanced processors. This compact form allows power to be delivered with minimal distance and loss, unlocking unprecedented efficiency, speed and scalability. As hyperscalers seek system-level solutions to support multi-kilowatt compute platforms, this collaboration validates Ferric's unique ability to solve critical power delivery bottlenecks. Ferric IVRs help reduce transmission losses and enable increases in current density—delivering performance gains and better total cost of ownership for cloud operators. "Ferric is thrilled to collaborate with Marvell in providing pre-validated IVR power solutions to their XPU customers," said Noah Sturcken, CEO of Ferric. "Our collaboration provides a streamlined path for integrating Ferric IVRs into some of the most sophisticated and power-hungry processors ever made." "Placing IVR under, near, or inside the package delivers greater performance and efficiency while giving cloud operators greater flexibility when it comes to developing or optimizing their infrastructure," said Will Chu, senior vice president and general manager of Custom Cloud Solutions at Marvell. "We look forward to working with Ferric to continue to bring pre-validated IVR solutions to our custom XPU customers." About Ferric Ferric is a leading innovator in integrated power conversion solutions, specializing in advanced voltage regulation technologies designed to optimize power delivery in next-generation computing systems. By providing dynamic control over power at the core level, Ferric enables greater computational density, higher efficiency and smarter performance across a wide range of industries. With proven reliability and system-level impact, Ferric's solutions play a pivotal role in unlocking the potential of tomorrow's most demanding technologies. Learn more at Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others. This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise. View source version on Contacts Lauren Fischer for FerricWireside CommunicationsEmail: lfischer@ Phone: +1-402-883-7508 Sign in to access your portfolio
Business Wire
25-06-2025
- Business
- Business Wire
Ferric and Marvell Collaborate to Advance Integrated Voltage Regulation for AI and Cloud Infrastructure
NEW YORK--(BUSINESS WIRE)--Ferric, Inc., a leader in cutting-edge power conversion solutions, announced its collaboration with Marvell Technology, Inc. (NASDAQ: MRVL) to develop optimized integrated power solutions for Marvell ® custom silicon platforms, designed to improve performance, efficiency and return on investment (ROI) for AI and cloud infrastructure. Ferric's proprietary thin-film magnetic technology enables the world's highest density DC-DC power converters and marks a breakthrough in integrated power management. By miniaturizing power regulation at the silicon level, Ferric Integrated Voltage Regulators (IVRs) are more than 10x smaller than conventional solutions— making them uniquely suited for in-package integration in advanced processors. This compact form allows power to be delivered with minimal distance and loss, unlocking unprecedented efficiency, speed and scalability. As hyperscalers seek system-level solutions to support multi-kilowatt compute platforms, this collaboration validates Ferric's unique ability to solve critical power delivery bottlenecks. Ferric IVRs help reduce transmission losses and enable increases in current density—delivering performance gains and better total cost of ownership for cloud operators. 'Ferric is thrilled to collaborate with Marvell in providing pre-validated IVR power solutions to their XPU customers,' said Noah Sturcken, CEO of Ferric. 'Our collaboration provides a streamlined path for integrating Ferric IVRs into some of the most sophisticated and power-hungry processors ever made.' 'Placing IVR under, near, or inside the package delivers greater performance and efficiency while giving cloud operators greater flexibility when it comes to developing or optimizing their infrastructure,' said Will Chu, senior vice president and general manager of Custom Cloud Solutions at Marvell. 'We look forward to working with Ferric to continue to bring pre-validated IVR solutions to our custom XPU customers.' About Ferric Ferric is a leading innovator in integrated power conversion solutions, specializing in advanced voltage regulation technologies designed to optimize power delivery in next-generation computing systems. By providing dynamic control over power at the core level, Ferric enables greater computational density, higher efficiency and smarter performance across a wide range of industries. With proven reliability and system-level impact, Ferric's solutions play a pivotal role in unlocking the potential of tomorrow's most demanding technologies. Learn more at Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others. This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.
Yahoo
29-05-2025
- Business
- Yahoo
Marvell Delivers Advanced Packaging Platform for Custom AI Accelerators
Novel multi-die packaging platform enables multi-die architectures with lower power consumption and reduced total cost Industry-first modular RDL interposer offers an alternative to traditional silicon interposers and enables supply chain flexibility for data center infrastructure Solution is production-qualified and now entering production ramp in support of customer-specific AI accelerator designs SANTA CLARA, Calif., May 29, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that lowers total cost of ownership (TCO) for custom AI accelerator silicon. The advanced packaging platform is part of the Marvell™ comprehensive IP portfolio for custom AI compute platforms—and enables multi-chip accelerator designs 2.8x larger than conventional single-die implementations. The Marvell approach can enable more efficient die-to-die interconnect, lower power consumption, increased chiplet yields and lower product cost, and provides a manufacturing alternative to traditional interposer-based multi-chip approaches. The packaging platform has been qualified with a major hyperscaler and is now ramping in production. In the AI era, chip packaging has become critical for increasing compute density while effectively managing power, thermal dissipation, optical I/O, signal integrity, and other factors that impact the performance and reliability in multi-die chiplet designs. Simultaneously, rising supply chain complexity and extended lead times present significant challenges for scaling advanced packaging solutions. The new Marvell packaging solution enables hyperscalers to overcome these barriers, accelerating time-to-market while offering supply chain flexibility. This is the latest innovation in a series of advancements for customers of Marvell custom XPU solutions. This highly optimized multi-chip packaging platform was designed from the ground up with the recently announced Marvell custom HBM and CPO solutions in mind. Taken together, Marvell is building the industry's broadest technology platform to enable custom XPU design for the future. "Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, senior vice president and general manager of Custom Cloud Solutions at Marvell. "Without it, AI infrastructure would be significantly more expensive and power-hungry. We look forward to collaborating with our partners and customers to further unlock the potential of advanced packaging." "Chiplets constitute one of the most dynamic segments of the semiconductor market. We anticipate that chiplet processor revenue will grow by 31% per year to reach $145 billion by 2030," said James Sanders, senior analyst at TechInsights. "Advanced packaging technologies are critical to the evolution of chiplets, giving designers a framework in which to experiment." Interposers serve as the foundational layer with compute, dies, memory, and other components stacked above and communicating through the interposer. The Marvell re-distribution layer (RDL) offers a compelling alternative to traditional silicon interposers for data center applications. The Marvell approach integrates 1390 mm2 of silicon and four pieces of high-bandwidth memory 3/3E (HBM3/3E) memory stacks and utilizes six interposer RDL layers. This enables multi-die AI accelerator solutions that are 2.8 times larger than the largest possible single-chip design. The Marvell multi-die packaging solution allows for shorter die-to-die interconnects and a modular RDL interposer. The Marvell RDL interposer reduces design cost through its modular design. In conventional chiplets, a single interposer will span the floor space of the chips it connects well as any area between them. If two computing cores are on opposite sides of a chiplet package, the interposer will cover the entire space. By contrast, Marvell RDL interposers are form-fitted to individual computing dies and connected by high-bandwidth paths. Not only does this approach reduce materials, it also increases chiplet yields by enabling manufacturers to replace individual dies. The Marvell multi-die packaging platform enables the integration of passive devices to reduce potential signal noise within the chiplet package caused by the power supply. In collaboration with the packaging ecosystem, Marvell has extended the solution to support multiple components within a single package, enabling the integration of the most complex AI designs. In addition, hyperscalers can now employ the packaging technology to build XPUs with HBM3 and HBM3E memory and Marvell is actively qualifying the technology for future HBM4 designs. Ecosystem Quotes "Leading-edge packaging technologies are critical to the adoption of chiplet architectures in current and future generations of AI and accelerated compute devices," said Dr. Mike Hung, senior vice president at Advanced Semiconductor Engineering (ASE). "Our close collaboration with Marvell enables us to develop solutions that deliver higher levels of performance and efficiency, while reaching a broader audience across the design ecosystem." "2.5D packaging technology continues to modernize heterogeneous IC packaging, enabling high-performance, cost-effective integration of multiple chiplet and memory modules," said Kevin Engel, chief operating officer at Amkor Technology. "This technology not only increases I/O and circuit density, but also paves the way for advanced 3D structures, making it indispensable for the next generation of applications." "The most complicated issue in the AI/ML solution design is to create an effective power delivery network, as GPUs are increasingly using more power. SEMCO is proud to have collaborated with Marvell to create a leading power delivery solution using its custom designed silicon capacitors and passive components," said Taegon Lee, executive vice president and head of the Strategic Marketing Center at Samsung Electro-Mechanics (SEMCO). "The ecosystem approach we collectively took in developing this solution will rapidly become the norm. We look forward to continued collaboration with Marvell." "RDL-based chiplet integration gives Marvell the flexibility to choose the optimal process technology for each part of their design," said CB Chang, president and CEO at Siliconware USA, Inc., a subsidiary of SPIL. "As the industry continues to move toward chiplet-based architectures, this flexibility enables more complex and efficient system integration." Marvell Custom Strategy The Marvell custom platform strategy seeks to deliver breakthrough results through unique semiconductor designs and innovative approaches. By combining expertise in system and semiconductor design, advanced process manufacturing, and a comprehensive portfolio of semiconductor platform solutions and IP—including electrical and optical serializer/deserializers (SerDes), die-to-die interconnects for 2D and 3D devices, silicon photonics, co-packaged copper, custom HBM, system-on-chip (SoC) fabrics, optical IO, and compute fabric interfaces such as PCIe Gen 7— Marvell is able to create platforms in collaboration with customers that transform infrastructure performance, efficiency and value. Marvell is currently collaborating with three of the top four hyperscalers to develop custom XPUs and CPUs for clouds and AI clusters as well as custom network interface controllers, CXL controllers and other devices to further optimize accelerated infrastructure. About MarvellTo deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better. Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others. This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the "Risk Factors" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise. For further information, contact:Kim Marklepr@ View original content to download multimedia: SOURCE Marvell Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
05-05-2025
- Business
- Business Wire
Vector Receives Strategic Investment from BVP Forge to Accelerate Workflow Automation for Logistics Networks
SAN FRANCISCO--(BUSINESS WIRE)--Today, Vector, a logistics workflow platform that enables shippers, carriers, and retailers to streamline operations, announced a strategic growth investment from BVP Forge to accelerate future growth. By digitizing paperwork, automating gate processes, and enabling real-time yard orchestration, Vector is a core workflow system that transforms supply chains and provides a network for carriers, drivers, and shippers to collaborate in one place. Some of the world's leading brands use Vector to connect with their suppliers, carriers, and customers, including FedEx, US Cold, Conagra, Coca-Cola, 7-11, PG&E, and more. 'I'm excited to accelerate growth and increase the capabilities of Vector for both our new and existing customers,' said Will Chu, Vector Co-Founder and CEO. 'This new financing will ultimately grow our sales, implementation, and engineering teams. We see a lot of opportunity ahead for the industry and look forward to continuing to deliver value to customers — from increasing throughput, to reducing costs and preventing theft.' BVP Forge will bring its business building program, BVP ForgeEdge™, to help Vector scale its platform, accelerate growth, and maximize customer impact. BVP Forge will also provide Vector access to the renowned growth IP, talent network, and roadmap insights of Bessemer Venture Partners, which has decades of experience scaling enterprise companies into market leaders. 'We're thrilled to partner with Will and the Vector team to help achieve their vision of becoming the source of truth for shippers, carriers, and retailers,' said Maren Hopkins, BVP Forge Principal. 'The Yard segment of the supply chain is on the cusp of transformation, and Vector has demonstrated impressive traction. With its multi-sided network, Vector is positioned to drive innovation, deliver measurable value for customers, and set new standards for efficiency and transparency in supply chain operations.' About Vector Vector is a leading digital pickup and delivery solution provider, offering electronic bill of lading, driver check-in, and yard automation. Shippers, carriers, and receivers benefit from faster throughput, fraud prevention, and real-time visibility throughout the transfer of custody. For more information, visit: About BVP Forge BVP Forge is the combination of a private equity firm for growth-oriented, self-sustaining software-enabled businesses paired with access to the Bessemer Venture Partners' global venture capital platform. BVP Forge combines Bessemer's front-line industry insights, proven growth IP, and legendary executive network with tailored resources for self-sustaining companies and BVP ForgeEdge™ operational resources. Mission-driven teams gain an ally who values their expertise, respects their legacy, and supports them to build a winning culture and business that withstands the test of time. BVP Forge invests from a $780M fund in partnership with the $18B+ Bessemer platform that has backed industry-defining businesses such as LinkedIn, Zapier, Clio, Procore, ServiceTitan, Shopify, Toast, and Twilio. For more information about BVP Forge, please visit
