Latest news with #X3D
Digital Trends
6 days ago
- Digital Trends
Intel may finally have an answer to AMD's 3D V-Cache CPUs
Intel is rumored to be developing a new desktop CPU design with significantly increased L3 cache, potentially aimed at countering AMD's popular Ryzen X3D processors. According to known leakers OneRaichu and Haze on X (formerly Twitter), Intel's next-generation Nova Lake desktop CPUs could feature a version with a 'big Last-Level Cache' (bLLC), offering up to 144MB of L3 cache. This would essentially be a big architectural shift for Intel, as the current-gen Arrow Lake-S desktop chips top out at 36MB of L3 cache. By contrast, a cache-heavy Nova Lake SKU would put Intel in direct competition with AMD's 3D V-Cache-enabled CPUs, such as the Ryzen 7 9800X3D, which have proven highly effective in gaming workloads thanks to their expanded cache. Recommended Videos The leakers suggest that one such Nova Lake variant could be a Core Ultra 5 chip with 8 performance cores and 16 efficiency cores, targeting the 125W desktop segment. Interestingly, higher-end models, such as a rumored 48-core (16P + 32E) version, may not include the large cache, indicating that Intel could be reserving the bLLC configuration for gaming or power-sensitive use cases rather than high-core-count multithreaded workloads. 8p, 16e 8p, 12e Both 4lpe, bLLC, 125w — Haze (@Haze2K1) June 17, 2025 If these details are accurate, the move would mirror AMD's own approach, where large caches are reserved for specific SKUs optimized for gaming or latency-sensitive tasks. The reported 144MB L3 figure would represent a fourfold increase over Arrow Lake's cache and could significantly boost performance in scenarios where memory latency is critical. Nova Lake is also expected to require a new socket, possibly LGA 1954, which would accompany broader platform-level changes. While that may limit upgrade paths from current-gen hardware, it could also signal a clean architectural break, enabling Intel to implement more aggressive enhancements. Though Intel has not confirmed these plans, the leaks offer an early look at how the company may respond to AMD's ongoing lead in gaming CPU performance under the leadership of CEO Lip-Bu Tan. Nova Lake is expected to arrive in 2026, and more details are likely to surface as development progresses.
Yahoo
01-07-2025
- Yahoo
Intel's next-gen Nova Lake CPUs rumoured to take on AMD's X3D CPUs at last thanks to gaming-friendly cache memory tile
When you buy through links on our articles, Future and its syndication partners may earn a commission. AMD launched its first X3D CPU with 3D V-Cache back in April 2022 in the Ryzen 7 5800X3D. Since then, AMD's X3D chips have pretty much been the weapon of choice for well-funded gamers. Where, you might ask, for art thou, Intel? According to the latest rumour, it might finally have an answer to X3D when it launches its next-gen Nova Lake CPUs in 2026, or perhaps early 2027. X user Haze2K1 has posted some specifications of purported Nova Lake CPU models and one detail stands out (via Club386). Along with listing core counts and TDP, both CPU models allegedly get something called "bLLC". That, supposedly, refers to something known as big Last Line Cache. And it's very much analogous to AMD's 3D V-Cache. Indeed, we know for sure Intel has such a technology, because it's incorporated in the new Clearwater Forest generation of Xeon server CPUs. But Intel has previously said it has no immediate plans to bring that technology to the desktop. The specifics of bLLC, at least as it pertains to that Xeon chip, entails what Intel calls Local Cache integrated into the base tile. The base tile is a chiplet in a modern Intel CPU package that sits beneath the active tiles, largely serving as an interconnect. At least, that's it's job in multi-die CPUs available today from Intel such as Lunar Lake and Arrow Lake. By adding cache to the base tile, Intel would end up with a similar broad approach to AMD's latest X3D CPUs. AMD's first two generations of X3D chips had the V-Cache attached to the top of the CPU dies, which was not optimal for thermal performance and therefore clock speed. However, for its third generation X3D CPUs, including the Ryzen 7 9800X3D, the V-Cache was moved below the CPU chiplets, essentially banishing the clock speed disadvantage of previous X3D CPU models and turning the latest generation into absolute gaming beasts. But before we all assume Intel's Nova Lake CPUs will therefore be killer for gaming, simply adding cache memory isn't a guarantee of better frame rates. The whole point of cache memory is to improve memory latency by reducing the need to go out over the main memory bus to the system RAM. And that, in turn, improves performance, especially in games. But for that cache to be really effective, it has to offer very low latency itself, which isn't a given. AMD's memory bus and cache architecture is highly optimised for low latency, but it's yet to be seen if Nova Lake will match AMD by that measure. AMD's has a super fast point-to-point internal interconnect for its CPUs, while Intel currently uses a ring bus to connect cores, graphics and higer-level cache memory. That ring interconnect is generally slower and suffers higher latency. By some measures, that gives Intel's Arrow Lake 512 GB/s of internal bandwidth to the 2.5 TB/s of AMD's equivalent technology. Anyway, the point is that Intel will need to do more than merely stuff some cache into the base tile to match the impact of AMD's 3D V-Cache in games. In other words, watch this space.
Yahoo
05-06-2025
- Business
- Yahoo
Intel Confirms 12 P-Core Bartlett Lake S CPU In Nova Lake Slide
Intel has given the first confirmation of the long-rumored Bartlett Lake CPU with 12 performance cores and no E cores. The surprise reveal comes in a slide about Intel's Time Coordinated Computing platform, which pushes high-performance edge computing. The document is designed to show how Intel's CPUs can manage real-time and general-purpose workloads simultaneously, showing current and future-generation CPUs that can do this. One of them is a 12-core Bartlett Lake design. Intel's desktop platforms have been rather uninspiring for the past few generations. The 14th Generation was barely a clock-speed increase over its predecessor, and saw very little movement between generations, especially with the flagship. The Arrow Lake generation that followed improved performance per watt and productivity workloads, but did little for gaming. Bartlett Lake is slotting somewhere in the middle, supporting the older socket design, but with a performance focus. Long-rumored as more of a competitor for AMD's gaming-focused X3D CPUs, the 12-core Bartlett Lake CPU is unique among Intel's existing designs since it has just one CPU core architecture onboard. It uses just performance cores, whereas all other Intel CPUs from the past few generations have offered either a small quantity of solo P cores, or a mixture of performance and efficiency (and sometimes low-power efficiency) cores. Credit: Intel The lack of any E cores will absolutely tank this chip's multithreading performance. But Intel's performance cores have long been impressively powerful, just hampered by their limited number and high power draw compared with AMD's alternatives. A 12-core Bartlett Lake CPU could end up being Intel's gaming performance king for a short time ahead of an Arrow Lake refresh later this year, or provide an alternative to older CPU generations like AMD's still-supported Ryzen 5000 series. No more details about the chip exist at this time, with this slide reveal being the first to even confirm its existence. It debuts on this slide alongside more established upcoming CPU generations, like Panther Lake and Nova Lake, with both performance S and efficient, U versions of the chips. Intel also gave the first lip-service to a generation of low-power chips called Wildcat Lake, which VideoCardz suggests as a probable successor for Twin Lake. Don't want to wait for Bartlett Lake or any other CPU launches? Here are the best CPU deals available right now.
Yahoo
03-06-2025
- Business
- Yahoo
Intel Confirms 12 P-Core Bartlett Lake S CPU In Nova Lake Slide
Intel has given the first confirmation of the long-rumored Bartlett Lake CPU with 12 performance cores and no E cores. The surprise reveal comes in a slide about Intel's Time Coordinated Computing platform, which pushes high-performance edge computing. The document is designed to show how Intel's CPUs can manage real-time and general-purpose workloads simultaneously, showing current and future-generation CPUs that can do this. One of them is a 12-core Bartlett Lake design. Intel's desktop platforms have been rather uninspiring for the past few generations. The 14th Generation was barely a clock-speed increase over its predecessor, and saw very little movement between generations, especially with the flagship. The Arrow Lake generation that followed improved performance per watt and productivity workloads, but did little for gaming. Bartlett Lake is slotting somewhere in the middle, supporting the older socket design, but with a performance focus. Long-rumored as more of a competitor for AMD's gaming-focused X3D CPUs, the 12-core Bartlett Lake CPU is unique among Intel's existing designs since it has just one CPU core architecture onboard. It uses just performance cores, whereas all other Intel CPUs from the past few generations have offered either a small quantity of solo P cores, or a mixture of performance and efficiency (and sometimes low-power efficiency) cores. Credit: Intel The lack of any E cores will absolutely tank this chip's multithreading performance. But Intel's performance cores have long been impressively powerful, just hampered by their limited number and high power draw compared with AMD's alternatives. A 12-core Bartlett Lake CPU could end up being Intel's gaming performance king for a short time ahead of an Arrow Lake refresh later this year, or provide an alternative to older CPU generations like AMD's still-supported Ryzen 5000 series. No more details about the chip exist at this time, with this slide reveal being the first to even confirm its existence. It debuts on this slide alongside more established upcoming CPU generations, like Panther Lake and Nova Lake, with both performance S and efficient, U versions of the chips. Intel also gave the first lip-service to a generation of low-power chips called Wildcat Lake, which VideoCardz suggests as a probable successor for Twin Lake. Don't want to wait for Bartlett Lake or any other CPU launches? Here are the best CPU deals available right now.
Yahoo
15-04-2025
- Business
- Yahoo
Applied Materials buys 9% stake in chip equipment supplier BESI
-- Applied Materials (NASDAQ:AMAT) has acquired a 9% stake in BE Semiconductor Industries (AS:BESI), becoming the Dutch chip equipment maker's largest shareholder, according to a filing on Monday. The move places Applied ahead of BlackRock (NYSE:BLK) Institutional Trust in terms of ownership, based on LSEG data. Shares in BE Semiconductor jumped more than 7% in Amsterdam trading Tuesday. BESI is known for producing the most precise hybrid bonding tools globally—a key technology in advanced semiconductor packaging that enables chips to be stacked directly on top of one another. The investment signals that Applied Materials is aligning with, rather than competing against, BESI's hybrid bonding technology. Unlike traditional packaging steps, hybrid bonding is integrated much closer to the front end of the semiconductor manufacturing process and complements Applied's existing equipment. The technique is already used in cutting-edge chips, such as AMD's X3D processors, where memory and compute components are joined at Taiwan's TSMC foundry. Applied Materials said it has no plans to increase its stake or pursue a seat on the board of BE Semiconductor, also known as Besi, according to a statement released on Monday. 'We view this as a strategic, long-term investment that demonstrates Applied Materials' commitment to co-developing the industry's most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,' said Terry Lee, a corporate vice president at Applied Materials. As of April 14, the chipmaker's shares were down roughly 11% year-to-date, weighed by cautious guidance issued in mid-February. Sentiment took another hit after U.S. President Trump announced a fresh round of tariffs. Related articles Morgan Stanley maintains Xian LONGi Silicon Materials at 'equalweight' with a price target of RMB38.00 Morgan Stanley maintains Nifco Inc at 'underweight' with a price target of JPY3100.00 Yandex granted Nasdaq lifeline subject to Russia restructuring Sign in to access your portfolio
