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Time of India
23-06-2025
- Business
- Time of India
Dimensity 8450 5G Chip launched by MediaTek in India: It will be available on Oppo Reno 14 Pro, Oppo K-series, and more
Dimensity 8450 5G Chip launched: India's mobile chip war is heating up as MediaTek's Dimensity 8450 stakes its claim against Qualcomm in the 5G arena. With MediaTek commanding over 50% market share in India's budget and mid‑range segments and eyeing premium space, the launch of this powerful chipset signals a bold challenge. The Dimensity 8450 is poised to accelerate 5G adoption across local OEMs, intensify competition, and rewrite the rules of the smartphone industry. As Indian consumers embrace affordable innovation and cutting-edge performance, this move could shift the balance of power. Stay tuned—this competition promises faster, more intelligent devices and a more exciting tech future for everyone. All about the new chip Another Oppo K-series smartphone is expected to feature the Dimensity 8450 soon after the new chip debits in the upcoming Oppo Reno 14 Pro. This makes the Indian market a crucial competition arena for the upcoming generation of high-end mobile devices. In the Indian smartphone System-on-Chip (SoC) industry, MediaTek is well-established, especially in the sub-Rs 30,000 sectors. However, Qualcomm, its opponent, has historically held the top spot in the premium market. With this introduction, MediaTek wants to increase its market share in the more costly smartphone segment. The Snapdragon 8s Gen 4 from Qualcomm is the direct rival of the Dimensity 8450. Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business Unit, emphasized the chip's architecture. "We are growing our portfolio of top mobile platforms with the release of the MediaTek Dimensity 8450, providing device makers and users with an even greater range of high-end experiences to pick from." "We're proving that outstanding performance and efficiency can coexist, ensuring consumers no longer have to choose between the two," he continued, referring to our All-Big Core design, also in our flagship chips. Increased competition is anticipated to result in a greater selection of high-end phones with more potent consumer features. With a powerful NPU 880 and a MediaTek Agentic AI Engine (DAE) for sophisticated AI and camera functionalities, the Dimensity 8450 strongly emphasises artificial intelligence. With a multi-frame EIS engine, it also promises more steady 4K video recording and better gaming performance. Various additional devices from partners like Vivo, Motorola, and Samsung were also displayed at the Delhi event, highlighting MediaTek's wide presence in the Indian market across various price points. For the latest and more interesting tech news, keep reading Indiatimes Tech.
Phone Arena
21-06-2025
- Phone Arena
MediaTek's new Dimensity 8450 is only a minor upgrade over the previous generation
– Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business Unit, June 2025. Receive the latest mobile news By subscribing you agree to our terms and conditions and privacy policy CPU : 8 x ARM Cortex-A725 cores (1x 1MB L2 + 3x 512KB L2 + 4x 256KB L2), 6MB L3 cache + 5MB SLC : 8 x ARM Cortex-A725 cores (1x 1MB L2 + 3x 512KB L2 + 4x 256KB L2), 6MB L3 cache + 5MB SLC GPU : Arm Mali-G720 MC7 : Arm Mali-G720 MC7 AI : MediaTek NPU 880 (Generative AI, Agentic AI Engine) : MediaTek NPU 880 (Generative AI, Agentic AI Engine) Display : WQHD+ up to 144Hz, dual screen support : WQHD+ up to 144Hz, dual screen support Camera : Up to 320MP sensor, Imagiq 1080 ISP with in-sensor zoom (QPD remozaic) : Up to 320MP sensor, Imagiq 1080 ISP with in-sensor zoom (QPD remozaic) Connectivity : 5G Sub-6GHz modem, 3CC Carrier Aggregation, up to 5.17 Gbps, Wi-Fi 6E (2T2R), Bluetooth 5.4 : 5G Sub-6GHz modem, 3CC Carrier Aggregation, up to 5.17 Gbps, Wi-Fi 6E (2T2R), Bluetooth 5.4 Memory : LPDDR5X RAM up to 8533 Mbps : LPDDR5X RAM up to 8533 Mbps Storage : UFS 4.0 + MCQ : UFS 4.0 + MCQ Video : 4K60 HDR (HLG) capture with Dual EIS : 4K60 HDR (HLG) capture with Dual EIS Power : UltraSave 3.0+ power efficiency Grab Surfshark VPN now at more than 50% off and with 3 extra months for free! Secure your connection now at a bargain price! We may earn a commission if you make a purchase Check Out The Offer MediaTek has flooded the smartphone market with chipsets that aren't much different when it comes to features and performance. The company's latest chip, Dimensity 8450, is basically a Dimensity 8400 with a few minor improvements that probably don't matter in the grand scheme of starters, MediaTek's new Dimensity 8450 chipset is based on TSMC's second-generation 4nm node, just like its predecessor, Dimensity 8400. On top of that, it features the same octa-core configuration: 1x Cortex-X4 core clocked at 3.25 GHz, 3x Cortex-A720 cores clocked at 3.0 GHz, and 4x Cortex-A520 cores clocked at the chipset uses the same Mali-G720 MC7 GPU (graphics processing unit), which is clocked at 1300 MHz. The only difference is that the Dimensity 8450 received some gaming and ISP optimizations, according to MediaTek One of the gaming-oriented boosts Dimensity 8450 got is StarSpeed Engine, a powerful GPU technology that promises to further enhance real-world gaming. Besides that, MediaTek says the IPS has been improved with live-stream optimizations, but that's about also important to mention that MediaTek claims the Dimensity 8450 features 'the most powerful generative AI in its class.'Another interesting improvement over the previous generation Dimensity chipset is the addition of a power saving feature: MediaTek UltraSave 3.0+. The latter is supposed to offer greater 5G power efficiency compared to Dimensity new chipset will most likely be included in a bunch of mid-range smartphones in the next coming months. However, considering how quickly new chipsets are launched, smartphone makers will move to the next new thing in a jiffy. The new Dimensity 8450 won't have a long life, but it's a small step toward MediaTek's next big first phones equipped with MediaTek's Dimensity 8450 chipset have already been announced. Reno 14 Pro should make its debut in India very soon, followed by a K series model.
Time of India
14-05-2025
- Business
- Time of India
MediaTek launches Dimensity 9400e flagship chipset, T930 platform for 5G FWA
NEW DELHI: MediaTek on Wednesday said premium 5G smartphones powered by its new Dimensity 9400e chipset will launch in the market from this month. Separately, the Taiwanese fabless chipmaker also rolled out the T930 chipset for 5G fixed wireless access (FWA) and mobile Wi-Fi devices , with support for sub-6GHz bands and capable of achieving 5G speeds of up to 10Gbps. Built on TSMC's third-generation 4nm process, the MediaTek Dimensity 9400e features an All Big Core CPU architecture, including four Cortex-X4 super cores with clock speeds of up to 3.4GHz and four Cortex-A720 big cores with clock speeds of 2.0GHz. The chipset is equipped with a 12-core GPU, Immortalis-G720, which supports hardware-level mobile ray tracing technology. The Dimensity 9400e supports the latest MediaTek NeuroPilot SDK for generative AI applications and services. It features enhanced inference decoding technology (SpD+), accelerating the computational efficiency of large language models. It also supports global mainstream large language models (LLMs) and small language models (SLMs), enabling on-device operation of DeepSeek-R1-Distill (Qwen1.5B/Llama7B/Llama8B) models, as well as Gemini Nano with Multimodality, LLaVA-1.5 7B, and more. 'With the launch of the MediaTek Dimensity 9400e, we are expanding our family of leading mobile platforms to ensure both device makers and users can select from a larger range of flagship experiences than ever before,' said Yenchi Lee, general manager of MediaTek's Wireless Communications Business Unit. On the other hand, the MediaTek T930 comes with 6CC-CA downlink, and five-layer 3Tx, enabling uplink performance of up to 2.8Gbps. It is also the first to support 8Rx with a total 200MHz downlink bandwidth, said MediaTek. In addition, the T930 supports 3GPP Release-18 standard, and more advanced modem features including 3Tx and L4S innovations proposed by MediaTek. The chipset combines the MediaTek M90 5G modem with a quad-core Arm Cortex-A55 CPU and a dedicated network processor. The full T930 platform also includes an RF transceiver, a GNSS receiver, and power management. The T930 platform can be combined with a dedicated NPU chip to form a Generative AI gateway device, providing advanced Edge AI processing and interaction with devices within the network. 'The growth of 5G mobile data is now being driven by a wide range of application services, while the rapid development of AI, which enables on-device learning, also aligns with new user demands and experiences,' said JC Hsu, corporate senior vice president of MediaTek. MediaTek said it has already become the preferred partner of leading international customers and is working closely with several ecosystem partners to integrate the T930 into next-generation FWA and Mi-Fi products for global markets.
