logo
Lutnick says he could hear 'expletives' out of Korea following trade deal with Japan

Lutnick says he could hear 'expletives' out of Korea following trade deal with Japan

Korea Herald4 days ago
US Commerce Secretary Howard Lutnick said Thursday that he could hear "expletives" out of South Korea after Japan reached a trade deal with US President Donald Trump's administration earlier this week.
Lutnick made the remarks, apparently suggesting that the tariff deal between the United States and Japan might have created a sense of urgency for South Korea, which seeks to reach a deal to avoid or lower the Trump administration's 25 percent "reciprocal" tariff set to kick in on Aug. 1.
"I could hear the expletives out of Korea when they read the Japanese deal because the Koreans and the Japanese ... they stare at each other," he said in a CNBC interview.
"So you can imagine what they were thinking when they saw that Japan made that deal ... They were like, 'Oh man!," he added, underscoring that Koreans "very much" want to make a deal.
On Tuesday, Trump announced the deal with Tokyo that would lower the threatened 25 percent reciprocal tariff for Japan to 15 percent in return for Japan's agreement to invest US$550 billion in the US, increase US rice imports by 75 percent and buy 100 Boeing aircraft, to name a few.
During the interview, Lutnick said that he will engage in a meeting with South Korean negotiators in Washington on the day, after bilateral high-level trade talks, slated for Friday, were postponed.
Korea's Industry Minister Kim Jung-kwan and Trade Minister Yeo Han-koo are currently in Washington amid Seoul's stepped-up efforts to strike a deal with the US
"Of course, they are going to be in my office today talking," the secretary said.
Seoul and Washington had planned to hold "two-plus-two" trade talks on Friday, where Seoul's Finance Minister Koo Yun-cheol, Trade Minister Yeo, Treasury Secretary Scott Bessent and US Trade Representative Jamieson Greer were set to get together.
Orange background

Try Our AI Features

Explore what Daily8 AI can do for you:

Comments

No comments yet...

Related Articles

Finance minister to hold talks with U.S. treasury secretary Thursday
Finance minister to hold talks with U.S. treasury secretary Thursday

Korea Herald

time6 hours ago

  • Korea Herald

Finance minister to hold talks with U.S. treasury secretary Thursday

Finance Minister Koo Yun-cheol will hold high-level trade talks with his U.S. counterpart in Washington later this week, the finance ministry said Monday, as the Aug. 1 deadline for tariff negotiations approaches. Koo will depart Tuesday for the U.S. capital, where he will hold talks with U.S. Treasury Secretary Scott Bessent on Thursday (local time), just one day before the United States is expected to resume hefty tariff enforcement on South Korean goods. The minister had originally been slated to attend a "2+2" meeting last week with Trade Minister Yeo Han-koo, along with Bessent and U.S. Trade Representative Jamieson Greer. However, the talks were postponed due to scheduling conflicts of Bessent. As other major economies have reached agreements with Washington, Seoul has been racing to stay at the negotiating table to finalize a trade agreement with Washington before the Aug. 1 deadline to reduce the 25 percent reciprocal tariff and sector-specific duties imposed on South Korean goods under the Trump administration. The reciprocal tariffs were initially implemented April 9 but were immediately suspended by President Trump for 90 days to allow for negotiations. The suspension has since been extended, but Washington indicated plans to resume enforcement Aug. 1 unless a deal is reached. (Yonhap)

USFK says decisions regarding joint drills will be made via 'established consultation'
USFK says decisions regarding joint drills will be made via 'established consultation'

Korea Herald

time7 hours ago

  • Korea Herald

USFK says decisions regarding joint drills will be made via 'established consultation'

U.S. Forces Korea (USFK) said Monday that decisions regarding potential changes in combined South Korea-U.S. drills "will be made through established consultation processes," after Seoul's unification minister said he will propose adjusting such drills to President Lee Jae Myung. Unification Minister Chung Dong-young made the remarks earlier in the day, hours after Pyongyang denounced the Lee administration of "blindly adhering" to the South Korea-U.S. alliance, declaring it will never engage in talks with Seoul. "As always, any decisions regarding alliance training and exercises will be made through established consultation processes," the USFK said in a statement. While noting that the USFK is "aware" of Chung's remarks, the armed service said it has yet to receive details of his proposal from the South Korean government. Chung's remarks came as South Korea and the U.S. are set to kick off their annual large-scale Ulchi Freedom Shield exercise next month. North Korea has long denounced the allies' joint military drills as rehearsals for an invasion and uses them as a pretext for provocations. South Korea and the U.S. have said their exercises are defensive in nature. Seoul's defense ministry reiterated that the allies have conducted regular joint drills to maintain their combined defense posture, saying there are "no changes so far" regarding the upcoming exercise. (Yonhap)

Can LG break into AI chips game with hybrid bonder?
Can LG break into AI chips game with hybrid bonder?

Korea Herald

time10 hours ago

  • Korea Herald

Can LG break into AI chips game with hybrid bonder?

Tech giant bets on in-house expertise to take on rivals, but faces uncertain demand and scalability hurdles LG Electronics is eyeing a bold expansion in its semiconductor equipment operations, developing critical machinery for manufacturing the high-bandwidth memory chips that power AI innovation. The South Korean tech giant said it has kicked off development of a hybrid bonder at its in-house R&D unit, the Production Engineering Research Institute. A hybrid bonder is a kind of chip packaging machine, and LG wants to develop one for use in the HBM chips used in AI. The confirmation comes after a recent media report that LG aims to commercialize the equipment by 2028. An LG spokesperson, however, said that while it is currently conducting technical research on hybrid bonders for HBM, the timeline for mass production remains undecided. For LG, semiconductors are a sensitive topic. The company's chip aspirations suffered a devastating blow during the 1997 Asian financial crisis, when government-mandated restructuring stripped away its chipmaking business, LG Semicon, and merged it into Hyundai Electronics, which later became SK hynix. But LG kept the flame alive, holding onto crucial design capabilities and continuing to develop custom chips for its own products. The company has also partnered with Canada-based AI chip design company Tenstorrent to develop AI chips together. Its Production Engineering Research Institute also sells packaging and testing equipment and has conducted research on HBM technologies. This time, LG appears to be seeking a new growth engine by entering the red-hot AI chips sector, in line with LG Group Chair Koo Kwang-mo's AI vision. Observers say that because the hybrid bonder market is still in its early stages, LG could gain an edge if it succeeds in developing it. 'LG is entering the market because there's clear business potential,' said Lee Jong-hwan, a system semiconductor engineering professor at Sangmyung University. 'HBM is expected to see continued growth because it is a critical component in AI chips, which are becoming dominant in the market.' Lee noted that the Production Engineering Research Institute has long handled equipment and systems related to mass production. 'So they have strengths in developing related tools. That's why they are confident in commercializing this technology,' Lee said Why hybrid bonders matter HBM chips — used in AI accelerators like Nvidia's GPUs — are built by stacking multiple DRAM chips vertically, like a high-rise tower, allowing rapid and efficient data transfer. The key to their performance hinges on how precisely and securely these memory chips are bonded together. That's where advanced packaging tools like the hybrid bonder and the widely-used thermocompression bonder, or TC bonder, come in. These machines physically connect the chips to form a single, high-performance memory unit. The hybrid bonder LG is developing promises a significant advancement over conventional TC bonders. TC bonding uses heat and pressure to attach the semiconductor chips, relying on microscopic bumps to connect the stacked dies. In contrast, hybrid bonding eliminates the bumps entirely and enables direct chip-to-chip connections. This allows for thinner chip stacks, improved thermal performance and higher stacking capability, ultimately enabling the high-performance packaging needed for cutting-edge AI chips. Only a few global companies, such as Netherlands-based Besi and US-based Applied Materials, have developed hybrid bonders, and even those have yet to be commercialized for HBM. If LG succeeds, it could carve out a lucrative niche in a fast-growing market. The global hybrid bonding equipment market is expected to grow from $1.5 billion in 2024 to $3.2 billion by 2033, according to market research firm Verified Market Research. 'Hybrid bonding has a clear advantage,' said Lee. 'AI chips require higher data throughput as models become more complex and training workload increases. This leads to significant heat generation, and hybrid bonding offers a structural advantage in managing thermal issues.' 'But mass production capability will be critical, and once those manufacturing challenges are addressed, hybrid bonding will be more favorable for future HBMs.' Heated competition Samsung and SK hynix, the world's two largest memory chip makers, are mulling the use of hybrid bonding in their next-generation HBM products, such as HBM4E. As the number of DRAM layers in HBM increases to 16 or even 20, the use of TC bonding is expected to reach its limits. With the major HBM players eyeing the hybrid bonding technology, the equipment market will hinge on who can mass produce reliable and scalable equipment the fastest. Major equipment makers are entering the fray. Hanmi Semiconductor, the market leader in TC bonders, which supplies HBM leaders SK hynix and Micron, announced Friday that it will invest 100 billion won ($72.67 million) in hybrid bonding technology, with plans to release a hybrid bonder by the end of 2027. The company is constructing a hybrid bonder factory in Incheon, with the goal of completion in the second half of next year. Hanwha Semitech, which also supplies TC bonders to SK Hynix, is also ramping up efforts to develop hybrid bonding equipment. Then there's Applied Materials, which in April became the largest shareholder of Besi, a move expected to accelerate the development of hybrid bonding technology. Semes, the semiconductor equipment subsidiary of Samsung Electronics, is also reportedly developing a hybrid bonder that could be used for Samsung's HBM. "Since B2B equipment production and supply depend on customer demand, actual rollouts will be determined by market response and client needs," said an industry official on condition of anonymity. "Currently SK hynix gets its TC bonder from Hanmi Semiconductor and Hanwha Semitech, while Micron also sources from Hanmi. If Samsung decides to use tools from Semes, the key for LG is to make a marketable product and secure customers." sahn@

DOWNLOAD THE APP

Get Started Now: Download the App

Ready to dive into a world of global content with local flavor? Download Daily8 app today from your preferred app store and start exploring.
app-storeplay-store